ADXL1004 Data Sheet
Rev. 0 | Page 14 of 14
OUTLINE DIMENSIONS
02-02-2017-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
0.30
0.25
0.20
5.10
5.00 SQ
4.90
*
1.85
1.80
1.75
0.45
0.40
0.35
0.20 MIN
3.80
3.70 SQ
3.60
PKG-004829
3.50 REF
*
COMPLIANT
TO
JEDEC STANDARDS MO-220-VHHD-4
WITH EXCEPTION TO PACKAGE HEIGHT.
SEATING
PLANE
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 1.8 mm Package Height
(CP-32-26)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range g Range Package Description Package Option
ADXL1004BCPZ −40°C to +125°C ±500 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26
ADXL1004BCPZ-RL −40°C to +125°C ±500 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26
ADXL1004BCPZ-RL7 −40°C to +125°C ±500 g 32-Lead Lead Frame Chip Scale Package [LFCSP] CP-32-26
EVAL-ADXL1004Z ADXL1004 Evaluation Board
1
Z = RoHS Compliant Part.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D16508-0-1/18(0)
