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PCF8566T/1,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
PCF8566_7
© NXP B.V
. 2009. All rights reser
ved.
Product data sheet
Rev
. 07 — 25 February 2009
37 of 48
NXP Semiconductors
PCF8566
Universal LCD driver f
or low m
ultiplex rates
14.
P
ac
kage outline
Fig 29.
P
ackage outline SO
T129-1 (DIP40)
UNIT
A
max.
1
2
b
1
cD
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.70
1.14
0.53
0.38
0.36
0.23
52.5
51.5
14.1
13.7
3.60
3.05
0.254
2.54
15.24
15.80
15.24
17.42
15.90
2.25
4.7
0.51
4
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
0.56
0.54
0.14
0.12
0.01
0.1
0.6
0.62
0.60
0.69
0.63
0.089
0.19
0.02
0.16
051G08
MO-015
SC-511-40
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
40
1
21
20
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1)
(1)
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
PCF8566_7
© NXP B.V
. 2009. All rights reser
ved.
Product data sheet
Rev
. 07 — 25 February 2009
38 of 48
NXP Semiconductors
PCF8566
Universal LCD driver f
or low m
ultiplex rates
Fig 30.
P
ackage outline SO
T158-1 (VSO40)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
Z
(1)
eH
E
LL
p
Qy
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762
2.25
12.3
11.8
1.15
1.05
0.6
0.3
7
0
o
o
0.1
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm (0.016 inch) maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.7
1.5
SOT158-1
95-01-24
03-02-19
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004
0.096
0.089
0.017
0.012
0.0087
0.0055
0.61
0.60
0.30
0.29
0.03
0.089
0.48
0.46
0.045
0.041
0.024
0.012
0.004
0.2
0.008
0.004
0.067
0.059
0.01
0
5
10 mm
scale
VSO40: plastic very small outline package; 40 leads
SOT158-1
A
max.
2.7
0.11
PCF8566_7
© NXP B.V
. 2009. All rights reser
ved.
Product data sheet
Rev
. 07 — 25 February 2009
39 of 48
NXP Semiconductors
PCF8566
Universal LCD driver f
or low m
ultiplex rates
15.
Bare die outline
Fig 31.
Bare die outline PCF8566U
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
PCF8566U
PCF8566U
Notes
1. Pad size
2. Passivation opening
UNIT
mm
max
nom
min
0.406
0.381
0.356
0.548
0.200
0.018
2.5
0.12
0.106
0.12
A
DIMENSIONS (mm are the original dimensions)
Wire bond die; 40 bonding pads; 2.5 x 2.91 x 0.381 mm
e
e
0
0.5
1 mm
scale
D
E
2.91
e
P
1
(1)
P
2
(2)
P
3
(1)
P
4
(2)
0.106
36
37
38
39
40
25
24
23
22
21
20
19
18
17
16
1
C2
C1
F
PC8566-1
234
5
10
9
8
7
6
33
34
35
11
12
13
14
15
28
27
26
29
31
30
32
A
detail X
P
2
P
1
P
3
P
4
D
E
X
y
0
x
0
08-06-19
08-09-03
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
PCF8566T/1,118
Mfr. #:
Buy PCF8566T/1,118
Manufacturer:
NXP Semiconductors
Description:
LCD Drivers LCD DVR UNVRSL LOW-MUX
Lifecycle:
New from this manufacturer.
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