PCF8566_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 25 February 2009 37 of 48
NXP Semiconductors
PCF8566
Universal LCD driver for low multiplex rates
14. Package outline
Fig 29. Package outline SOT129-1 (DIP40)
UNIT
A
max.
1 2
b
1
cD E e M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.70
1.14
0.53
0.38
0.36
0.23
52.5
51.5
14.1
13.7
3.60
3.05
0.2542.54 15.24
15.80
15.24
17.42
15.90
2.254.7 0.51 4
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
0.56
0.54
0.14
0.12
0.010.1 0.6
0.62
0.60
0.69
0.63
0.089 0.19 0.02 0.16
051G08 MO-015 SC-511-40
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
40
1
21
20
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1)(1)
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
PCF8566_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 25 February 2009 38 of 48
NXP Semiconductors
PCF8566
Universal LCD driver for low multiplex rates
Fig 30. Package outline SOT158-1 (VSO40)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2)
Z
(1)
eH
E
LL
p
Qywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
0.3
0.1
2.45
2.25
0.25
0.42
0.30
0.22
0.14
15.6
15.2
7.6
7.5
0.762 2.25
12.3
11.8
1.15
1.05
0.6
0.3
7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm (0.016 inch) maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.7
1.5
SOT158-1
95-01-24
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004
0.096
0.089
0.017
0.012
0.0087
0.0055
0.61
0.60
0.30
0.29
0.03 0.089
0.48
0.46
0.045
0.041
0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.01
0 5 10 mm
scale
VSO40: plastic very small outline package; 40 leads
SOT158-1
A
max.
2.7
0.11
PCF8566_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 25 February 2009 39 of 48
NXP Semiconductors
PCF8566
Universal LCD driver for low multiplex rates
15. Bare die outline
Fig 31. Bare die outline PCF8566U
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
PCF8566U
PCF8566U
Notes
1. Pad size
2. Passivation opening
UNIT
mm
max
nom
min
0.406
0.381
0.356
0.548
0.200
0.018
2.5
0.12 0.106 0.12
A
DIMENSIONS (mm are the original dimensions)
Wire bond die; 40 bonding pads; 2.5 x 2.91 x 0.381 mm
e
e
0 0.5 1 mm
scale
D E
2.91
e P
1
(1)
P
2
(2)
P
3
(1)
P
4
(2)
0.106
36 37 38 39 40
25 24 23 22 21 20 19 18 17 16
1
C2
C1
F
PC8566-1
2345
10
9
8
7
6
33
34
35
11
12
13
14
15
28
27
26
29
31
30
32
A
detail X
P
2
P
1
P
3
P
4
D
E
X
y
0
x
0
08-06-19
08-09-03

PCF8566T/1,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
LCD Drivers LCD DVR UNVRSL LOW-MUX
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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