MRF6S23140HR3

MRF6S23140HR3 MRF6S23140HSR3
1
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N-Channel Enhancement - Mode Lateral MOSFETs
Designed for CDMA base station applications with frequencies from 2300 to
2400 MHz. Suitable for WiMAX, WiBro and multicarrier amplifier applications.
To be used in Class AB and Class C WLL applications.
Typical 2 -Carrier W-CDMA Performance: V
DD
= 28 Volts, I
DQ
= 1300 mA,
P
out
= 28 Watts Avg., f = 2390 MHz, Channel Bandwidth = 3.84 MHz,
PAR = 8.5 dB @ 0.01% Probability on CCDF.
Power Gain — 15.2 dB
Drain Efficiency — 25%
IM3 @ 10 MHz Offset — -37 dBc in 3.84 MHz Channel Bandwidth
ACPR @ 5 MHz Offset -40 dBc in 3.84 MHz Channel Bandwidth
Capable of Handling 10:1 VSWR, @ 32 Vdc, 2390 MHz, 140 Watts CW
Output Power
Features
Characterized with Series Equivalent Large-Signal Impedance Parameters
Internally Matched for Ease of Use
Qualified Up to a Maximum of 32 V
DD
Operation
Integrated ESD Protection
Designed for Lower Memory Effects and Wide Instantaneous Bandwidth
Applications
RoHS Compliant
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain-Source Voltage V
DSS
-0.5, +68 Vdc
Gate-Source Voltage V
GS
-0.5, +12 Vdc
Storage Temperature Range T
stg
- 65 to +150 °C
Case Operating Temperature T
C
150 °C
Operating Junction Temperature
(1,2)
T
J
225 °C
Table 2. Thermal Characteristics
Characteristic Symbol Value
(2,3)
Unit
Thermal Resistance, Junction to Case
Case Temperature 82°C, 140 W CW
Case Temperature 75°C, 28 W CW
R
θ
JC
0.29
0.33
°C/W
Table 3. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22-A114) 2 (Minimum)
Machine Model (per EIA/JESD22-A115) A (Minimum)
Charge Device Model (per JESD22-C101) IV (Minimum)
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access
MTTF calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
Document Number: MRF6S23140H
Rev. 2, 12/2008
Freescale Semiconductor
Technical Data
MRF6S23140HR3
MRF6S23140HSR3
2300 -2400 MHz, 28 W AVG., 28 V
2 x W- CDMA
LATERAL N -CHANNEL
RF POWER MOSFETs
CASE 465C-02, STYLE 1
NI-880S
MRF6S23140HSR3
CASE 465B- 03, STYLE 1
NI-880
MRF6S23140HR3
Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
2
RF Device Data
Freescale Semiconductor
MRF6S23140HR3 MRF6S23140HSR3
Table 4. Electrical Characteristics
(T
C
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
= 68 Vdc, V
GS
= 0 Vdc)
I
DSS
10 µAdc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 28 Vdc, V
GS
= 0 Vdc)
I
DSS
1 µAdc
Gate-Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
I
GSS
500 nΑdc
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 300 µAdc)
V
GS(th)
1 2 3 Vdc
Gate Quiescent Voltage
(V
DD
= 28 Vdc, I
D
= 1300 mAdc, Measured in Functional Test)
V
GS(Q)
2 2.8 4 Vdc
Drain-Source On-Voltage
(V
GS
= 10 Vdc, I
D
= 3 Adc)
V
DS(on)
0.1 0.21 0.3 Vdc
Dynamic Characteristics
(1)
Reverse Transfer Capacitance
(V
DS
= 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
C
rss
2 pF
Functional Tests (In Freescale Test Fixture, 50 ohm system) V
DD
= 28 Vdc, I
DQ
= 1300 mA, P
out
= 28 W Avg., f = 2390 MHz, 2-Carrier
W-CDMA, 3.84 MHz Channel Bandwidth Carriers. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset. IM3 measured in
3.84 MHz Bandwidth @ ±10 MHz Offset. PAR = 8.5 dB @ 0.01% Probability on CCDF.
Power Gain G
ps
13 15.2 17 dB
Drain Efficiency η
D
23 25 %
Intermodulation Distortion IM3 -37 -35 dBc
Adjacent Channel Power Ratio ACPR -40 -38 dBc
Input Return Loss IRL -15 dB
1. Part internally matched both on input and output.
MRF6S23140HR3 MRF6S23140HSR3
3
RF Device Data
Freescale Semiconductor
Figure 1. MRF6S23140HR3(SR3) Test Circuit Schematic
Z10 0.193 x 1.170 Microstrip
Z11, Z13 0.712 x 0.095 Microstrip
Z12, Z14 0.098 x 0.095 Microstrip
Z15 0.115 x 0.550 Microstrip
Z16 0.250 x 0.110 Microstrip
Z17 0.539 x 0.068 Microstrip
Z18 0.956 x 0.068 Microstrip
PCB Taconic RF-35, 0.030, ε
r
= 3.5
Z1 0.678 x 0.068 Microstrip
Z2 0.420 x 0.068 Microstrip
Z3 0.845 x 0.200 Microstrip
Z4 0.175 x 0.530 Microstrip
Z5, Z6 0.025 x 0.530 Microstrip
Z7 0.514 x 0.050 Microstrip
Z8 0.507 x 0.050 Microstrip
Z9 0.097 x 1.170 Microstrip
Z1
RF
INPUT
C1
Z2 Z3 Z4 Z5 Z6
DUT
Z9
C2
RF
OUTPUT
Z10 Z15 Z16 Z17 Z18
C9
B1
V
BIAS
V
SUPPLY
C11
+
C10C12
+
R1
C3
Z7
Z8
C4
B2
C15
+
C14C16
+
C13
C21 C22C7
C23
C24
+
Z11
C6
Z12
C17 C18C5
C19
C20
+
Z14
C8
Z13
Table 5. MRF6S23140HR3(SR3) Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
B1, B2 Ferrite Beads, Short 2743019447 Fair-Rite
C1, C2, C3, C4, C5, C6, C7, C8 5.6 pF Chip Capacitors ATC100B5R6CT500XT ATC
C9, C13 0.01 µF, 100 V Chip Capacitors C1825C103J1RAC Kemet
C10, C14, C17, C21 2.2 µF, 50 V Chip Capacitors C1825C225J5RAC Kemet
C11, C15 22 µF, 25 V Tantalum Chip Capacitors T491D226K025AT Kemet
C12, C16 47 µF, 16 V Tantalum Chip Capacitors T491D476K016AT Kemet
C18, C19, C22, C23 10 µF, 50 V Chip Capacitors GRM55DR61H106KA88B Murata
C20, C24 330 µF, 63 V Electrolytic Capacitors EMVY630GTR331MMH0S Chemi-Con
R1 10 , 1/4 W Chip Resistor CRCW120610R0FKEA Vishay

MRF6S23140HR3

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF MOSFET Transistors HV6 2.3GHZ 28W
Lifecycle:
New from this manufacturer.
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