MRF6S23140HR3

4
RF Device Data
Freescale Semiconductor
MRF6S23140HR3 MRF6S23140HSR3
Figure 2. MRF6S23140HR3(SR3) Test Circuit Component Layout
B1
CUT OUT AREA
MRF6S23140H
Rev 3
R1
C12 C11
C9*
C10*
C1
C4
C13*
C14*
C16
B2
C15
C8
C7
C23
C24
C21 C22
C2
C17 C18
C20
C19C6
C5
* Stacked
C3
MRF6S23140HR3 MRF6S23140HSR3
5
RF Device Data
Freescale Semiconductor
TYPICAL CHARACTERISTICS
G
ps
, POWER GAIN (dB)
IRL, INPUT RETURN LOSS (dB)
IM3 (dBc), ACPR (dBc)
−18
−9
−12
−15
24302270
IRL
G
ps
ACPR
f, FREQUENCY (MHz)
Figure 3. 2-Carrier W- CDMA Broadband Performance @ P
out
= 28 Watts Avg.
2410239023702350233023102290
15.6
15.5
−42
28
27
26
−36
−40
η
D
, DRAIN
EFFICIENCY (%)
η
D
15.4
15.3
15.2
15
14.8
14.9
15.1
−38
−34
25
−6
G
ps
, POWER GAIN (dB)
IRL, INPUT RETURN LOSS (dB)
IM3 (dBc), ACPR (dBc)
−18
−9
−12
−15
24302270
IRL
G
ps
ACPR
IM3
f, FREQUENCY (MHz)
Figure 4. 2-Carrier W- CDMA Broadband Performance @ P
out
= 56 Watts Avg.
2410239023702350233023102290
15.1
15
−33
38
37
36
−27
−31
η
D
, DRAIN
EFFICIENCY (%)
η
D
14.9
14.8
14.7
14.5
14.3
14.4
14.6
−29
−25
35
−6
Figure 5. Two-Tone Power Gain versus
Output Power
100
11
18
1
I
DQ
= 1950 mA
1625 mA
P
out
, OUTPUT POWER (WATTS) PEP
16
15
14
10 300
G
ps
, POWER GAIN (dB)
13
1300 mA
975 mA
650 mA
V
DD
= 28 Vdc
f1 = 2345 MHz, f2 = 2355 MHz
Two−Tone Measurements, 10 MHz Tone Spacing
Figure 6. Third Order Intermodulation Distortion
versus Output Power
−50
1
I
DQ
= 650 mA
P
out
, OUTPUT POWER (WATTS) PEP
100
−20
−30
−40
−60
V
DD
= 28 Vdc
f1 = 2345 MHz, f2 = 2355 MHz
Two−Tone Measurements, 10 MHz Tone Spacing
10
INTERMODULATION DISTORTION (dBc)
IMD, THIRD ORDER
−10
1625 mA
975 mA
1300 mA
17
12
300
V
DD
= 28 Vdc
P
out
= 28 W (Avg.)
I
DQ
= 1300 mA, 2−Carrier W−CDMA
10 MHz Carrier Spacing, 3.84 MHz Channel Bandwidth
PAR = 8.5 dB @ 0.01% Probability (CCDF)
IM3
V
DD
= 28 Vdc
P
out
= 56 W (Avg.)
I
DQ
= 1300 mA, 2−Carrier W−CDMA
10 MHz Carrier Spacing, 3.84 MHz Channel Bandwidth
PAR = 8.5 dB @ 0.01% Probability (CCDF)
1950 mA
6
RF Device Data
Freescale Semiconductor
MRF6S23140HR3 MRF6S23140HSR3
TYPICAL CHARACTERISTICS
Figure 7. Intermodulation Distortion Products
versus Tone Spacing
10
−60
0
0.1
7th Order
TWO−TONE SPACING (MHz)
V
DD
= 28 Vdc, P
out
= 140 W (PEP)
I
DQ
= 1300 mA, Two−Tone Measurements
(f1 + f2)/2 = Center Frequency of 2350 MHz
5th Order
3rd Order
−20
−30
−40
−50
1 100
IMD, INTERMODULATION DISTORTION (dBc)
Figure 8. Pulsed CW Output Power versus
Input Power
43
59
P
in
, INPUT POWER (dBm)
V
DD
= 28 Vdc, I
DQ
= 1300 mA
Pulsed CW, 8 µsec(on), 1 msec(off)
f = 2350 MHz
49
45
3331 3735 41
Actual
Ideal
57
55
51
53
47
29
P
out
, OUTPUT POWER (dBm)
IM3 (dBc), ACPR (dBc)
Figure 9. 2 -Carrier W -CDMA ACPR, IM3, Power Gain
and Drain Efficiency versus Output Power
0 −55
P
out
, OUTPUT POWER (WATTS) AVG.
42
−20
30
−25
24
−30
18
−35
6
−45
1 10 100
−40
12
IM3
G
ps
T
C
= − 30_C
η
D
, DRAIN EFFICIENCY (%), G
ps
, POWER GAIN (dB)
36
−50
η
D
25_C
−30_C
85_C
ACPR
−10
39
P6dB = 53.51 dBm (224.39 W)
P3dB = 53.04 dBm (201.42 W)
P1dB = 52.22 dBm (162.72 W)
0.5 300
25_C
85_C
−30_C
25_C
−30_C
85_C
V
DD
= 28 Vdc, I
DQ
= 1300 mA
f1 = 2345 MHz, f2 = 2355 MHz
2−Carrier W−CDMA, 10 MHz
Carrier Spacing, 3.84 MHz Channel
Bandwidth, PAR = 8.5 dB @ 0.01%
Probability (CCDF)

MRF6S23140HR3

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF MOSFET Transistors HV6 2.3GHZ 28W
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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