LQH2MPN4R7MGRL Datasheet LQH2MPN4R7MGRL, LQH2MPN150MGRL, LQH2MPN470MGRL | P1-P3

SpecNo.JELF243A-0142B-01 P1/8

MURATA MFG.CO., LTD

Reference

Only

CHIP COIL（CHIP INDUCTORS）LQH2MPN□□□□GRL REFERENCE SPECIFICATION

1.Scope

This reference specification applies to LQH2MPN_GR Series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ

H 2M P N 100 M G R L

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W) and

L:Taping

Characteristics

3.Rating

・ Operating Temperature Rang・ e

(Ambient temperature; Self-temperature rise is not included) -40 to +105°C

(Product temperature; Self- temperature rise is included) -40 to +125°C

Storage Temperature Range・・ -40 to +105°C

Customer

Part Number

MURATA

Part Number

Inductance

Resistance

()

Self

Resonant

Frequency

(MHz min)

Rated Current(mA)

(Based on

inductance

change)

*2 (Based on

Temperature rise)

(µH) Tolerance

Ambient

temperature

(85℃)

Ambient

temperature

(105℃)

LQH2MPNR33NGRL 0.33

N:±30%

0.15±20% 130 2200 1130 670

LQH2MPNR47NGRL 0.47 0.18±20% 120 1950 1060 630

LQH2MPN1R0NGRL 1.0 0.25±20% 100 1550 900 540

LQH2MPN1R5NGRL 1.5 0.32±20% 60 1330 790 470

LQH2MPN2R2MGRL 2.2

M:±20%

0.39±20% 50 1180 680 400

LQH2MPN3R3MGRL 3.3 0.47±20% 45 1020 640 380

LQH2MPN4R7MGRL 4.7 0.60±20% 40 870 580 340

LQH2MPN6R8MGRL 6.8 0.72±20% 35 730 530 310

LQH2MPN100MGRL 10 0.88±20% 30 610 480 280

LQH2MPN150MGRL 15 1.7±20% 25 490 340 200

LQH2MPN220MGRL 22 2.1±20% 20 410 290 170

LQH2MPN330MGRL 33 4.3±20% 15 310 200 120

LQH2MPN470MGRL 47 5.3±20% 10 270 180 110

LQH2MPN680MGRL 68 6.7±20% 7 230 160 100

LQH2MPN820MGRL 82 7.3±20% 5 210 150 90

*1: When applied Rated current to the Products, Inductance will be within ±30% of initial inductance value range .

*2: Keep the temperature(ambient temperature plus self-generation of heat) under 125℃.

*3: When applied rated current to the Products, temperature rise caused by self-generated heat shall be limited to 40 max.℃

(Ambient temperature 85℃).

*4:When applied rated current to the Products,temperature rise caused by self-generated heat shall be limited to 20 ℃

max.(Ambient temperature 85-105℃).

4. Testing Conditions

《Unless otherwise specified》《In case of doubt》

Temperature : Ordinary Temperature (15 to 35°C) Temperature

: 20 ± 2°C

Humidity

: Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

SpecNo.JELF243A-0142B-01 P2/8

MURATA MFG.CO., LTD

Reference

Only

※no marking

■unit mass(Typical value)

0.010g

2.0±0.1

1.0±0.2

1.6±0.1

0.65±0.2

0.90±0.05

(in mm)

5.Appearance and Dimensions

6.Electrical Performance

No. Item Specification Test Method

6.1 Inductance Inductance shall meet item 3. Measuring Equipment : Agilent 4192A or equivalent

Measuring Frequency:1MHz

6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter

6.3 Self Resonant

Frequency

(S.R.F)

S.R.F shall meet item 3.

Measuring Equipment: Agilent 4991A or equivalent

7.Mechanical Performance

No. Item Specification Test Method

7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate

Force: 5N

Hold Duration: 5±1s

7.2 Bending Test Substrate: Glass-epoxy substrate

(100×40×0.8mm)

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 5seconds.

(in mm)

7.3 Vibration Chip coil shall not be damaged. Oscillation Frequency : 10 to 2000 to 10Hz for 20

min

Total amplitude : 1.5 mm or Acceleration amplitude

98m/s

whichever is smaller.

Testing Time: A period of 2 hours in each of

3 mutually perpendicular

directions.(Total 6 hours)

7.4 Solderability The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux:Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating:150±10°C / 60 to 90s

Solder Temperature:240±5°C

Immersion Time:3±1 s

Ｆ

Chip coil

Substrate

R230

Deflection

Product

Pressure jig

SpecNo.JELF243A-0142B-01 P3/8

MURATA MFG.CO., LTD

Reference

Only

No. Item Specification Test Method

7.5 Resistance to

Soldering Heat

Appearance: No damage

Inductance Change: within ±20%

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90s

Solder Temperature: 270±5°C

Immersion Time: 10±1 s

Then measured after exposure in the room condition

for 24±2 hours.

8.Environmental Performance (It shall be soldered on the substrate.)

No. Item Specification Test Method

8.1 Heat Resistance Appearance:No damage

Inductance Change: within ± 10%

DC Resistance Change:

within ± 10%

Temperature: 105±2°C

Time: 1000± hours

Then measured after exposure in the room condition

for 24±2 hours.

8.2 Cold Resistance Temperature: -40±2°C

Time: 1000± hours

Then measured after exposure in the room condition

for 24±2 hours.

8.3 Humidity Temperature: 85±2°C

Humidity: 80~85%(RH)

Time: 1000± hours

Then measured after exposure in the room condition

for 24±2 hours.

8.4 Temperature

Cycle

1 cycle:

1 step: -40±2°C / 30±3 minutes

2 step:Ordinary temp. / 10 to 15 minutes

3 step:+105±2°C / 30±3 min

4 step: Ordinary temp. / 10 to 15 minutes

Total of 100 cycles

Then measured after exposure in the room condition

for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

Dimension of the Cavity is measured at the bottom side.

2.3±0.1



1.5

1.9±0.1

4.0±0.1

2.0±0.05

4.0±0.1

+0.1

-0

1.75±0.1

3.5±0.05

8.0±0.2

1.05±0.1

0.25

Direction of feed

(in mm)

※

Lead-in/out wire

※

The packing directions of the chip coil

in taping are unified with the in/out

positions of the lead wire.

( )

P1-P3 P4-P6 P7-P8

LQH2MPN4R7MGRL

Mfr. #:

Buy LQH2MPN4R7MGRL

Manufacturer:

Murata Electronics

Description:

Fixed Inductors 0806 4.7uH 20% 870mA 0.72ohms

Lifecycle:

New from this manufacturer.

Delivery:

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LQH2MPN4R7MGRL

LQH2MPN4R7MGRL

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