SpecNo.JELF243A-0142B-01 P5/8
MURATA MFG.CO., LTD
Reference
Only
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer
Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (7) Traffic signal equipment
(2) Aerospace equipment (8) Disaster prevention / crime prevention equipment
(3) Undersea equipment (9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
11.2 Flux, Solder
Flux
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
Solder
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
11.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Chip Coil
Solder Resist
Land
2.6
0.8
1.0
(in mm)
W
D
Label
H
