SpecNo.JELF243A-0142B-01 P7/8
MURATA MFG.CO., LTD
Reference
Only
11.6 Cleaning Conditions
Products shall be cleaned on the following conditions. But, Products can be used without cleaning,too.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.7 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.8 Temperature rating of the circuit board and components
located around
Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
11.9 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be
touched to the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
