LTM4608
19
4608fd
applicaTions inForMaTion
Figure 15. No Heat Sink with 5V
IN
to 3.3V
OUT
Figure 16. BGA Heat Sink with 5V
IN
to 3.3V
OUT
AMBIENT TEMPERATURE (°C)
40
LOAD CURRENT (A)
5
6
7
120
4608 F15
4
3
0
1
60
80
100
50
70
90
110
2
9
8
400LFM
200LFM
0LFM
AMBIENT TEMPERATURE (°C)
40
LOAD CURRENT (A)
5
6
7
120
4608 F16
4
3
0
1
60
80
100
50
70
90
110
2
9
8
400LFM
200LFM
0LFM
Table 4. 1.5V Output
DERATING CURVE V
IN
(V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK
θ
JA
(°C/W)
Figures 9, 11 3.3, 5 Figures 7, 8 0 None 25
Figures 9, 11 3.3, 5 Figures 7, 8 200 None 21
Figures 9, 11 3.3, 5 Figures 7, 8 400 None 20
Figures 10, 12 3.3, 5 Figures 7, 8 0 BGA Heat Sink 23.5
Figures 10, 12 3.3, 5 Figures 7, 8 200 BGA Heat Sink 22
Figures 10, 12 3.3, 5 Figures 7, 8 400 BGA Heat Sink 22
Table 5. 3.3V Output
DERATING CURVE V
IN
(V) POWER LOSS CURVE AIR FLOW (LFM) HEAT SINK
θ
JA
(°C/W)
Figure 15 5 Figure 8 0 None 25
Figure 15 5 Figure 8 200 None 21
Figure 15 5 Figure 8 400 None 20
Figure 16 5 Figure 8 0 BGA Heat Sink 23.5
Figure 16 5 Figure 8 200 BGA Heat Sink 22
Figure 16 5 Figure 8 400 BGA Heat Sink 22
LTM4608
20
4608fd
applicaTions inForMaTion
Safety Considerations
The LTM4608 modules do not provide isolation from V
IN
to V
OUT
. There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4608 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Use large PCB copper areas for high current path,
including V
IN
, GND and V
OUT
. It helps to minimize the
PCB conduction loss and thermal stress.
Figure 17. Recommended PCB Layout
For easier board layout and PCB assembly due to increased
spacing between land grid pads, please refer to the LTM4608A.
• Placehighfrequencyceramicinputandoutputcapaci-
tors next to the V
IN
, GND and V
OUT
pins to minimize
high frequency noise.
• Placeadedicatedpowergroundlayerunderneaththe
unit.
• Tominimizetheviaconductionlossandreducemodule
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Donotputviasdirectlyonthepads,unlesstheyare
capped.
• UseaseparatedSGNDgroundcopperareaforcom-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
Figure 17 gives a good example of the recommended layout.
GND
GND
GND
4608 F17
C
IN
C
OUT
C
OUT
C
OUT
C
IN
V
IN
V
OUT
LTM4608
21
4608fd
Typical applicaTions
Figure 18. Typical 3V to 5.5V
IN
, 2.5V at 8A Design
Figure 19. Two LTM4608s in Parallel, 1.5V at 16A Design.
See Also Dual 8A per Channel LTM4616
V
IN
SV
IN
SW
RUN
PLLLPF
TRACK
MODE
PHMODE
V
OUT
FB
I
TH
I
THM
PGOOD
BSEL
MGN
CLKOUT GND
CLKIN
RUN
TRACK
100µF
6.3V
X5R
C4
100pF
10µF
3.32k
V
OUT
1.5V
16A
V
IN
3V TO 5.5V
LTM4608
SGND
V
IN
SV
IN
SW
RUN
PLLLPF
TRACK
MODE
PHMODE
V
OUT
FB
I
TH
I
THM
PGOOD
BSEL
MGN
CLKOUT GND
CLKIN
C2
10µF
C3
100µF
6.3V
X5R
C1
100µF
6.3V
X5R
4608 F19
LTM4608
SGND
50k
50k
V
IN
V
IN
SV
IN
SW
RUN
PLLLPF
TRACK
MODE
PHMODE
V
OUT
FB
I
TH
I
THM
PGOOD
BSEL
MGN
PGOOD
(HIGH = 10%)
(FLOAT = 15%)
(LOW = 5%)
A
IN
2
U1: PERICOM PI74ST1G126CEX
OR TOSHIBA TC7SZ126AFE
1
5
4
3
OE
100k
V
IN
V
IN
Y
OUT
BSEL
MODE
PHMODE
CLKOUT GND
CLKIN
CLKIN
C1
220pF
C
OUT
100µF
C
IN
10µF
C3
47pF
R
FB
3.09k
50k
50k
4608 F18
V
OUT
2.5V
8A
8A AT 5V INPUT
6A AT 3.3V INPUT
V
IN
3V TO 5.5V
LTM4608
SGND
U1
OE
H
H
L
A
IN
H
L
X
Y
OUT
H
L
Z
MGN
H
L
V
IN
/2
MARGIN VALUE
+ OF BSEL SELECTION
– OF BSEL SELECTION
NO MARGIN

LTM4608EV#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2.7VINMIN, 8A Step-down Module Regulator
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet