3/17
L9362
THERMAL DATA
ABSOLUTE MAXIMUM RATINGS
For externally applied voltages or currents exceeding these limits damage of the circuit may occur
Note: The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent
damage to the IC will result.
25 NON3 Inverted Control Signal Input Digital input, Schmitt trigger, internal Pullup current
26 NRES Inverted Reset Input Digital input, Schmitt trigger, internal Pullup current
27 N.C.
28 VCC 5V Supply Voltage Input
29 N.C.
30 NON2 Inverted Control Signal Input Digital input, Schmitt trigger, internal Pullup current
31 NON1 Inverted Control Signal Input Digital input, Schmitt trigger, internal Pullup current
32 OUT2 Output Power Switch
33 OUT2 Output Power Switch
34 CFB2 Output Current feedback Sinks current proportional to I
OUT2
35 N.C.
36 PGND2 Power Ground
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Thermal resistance
R
th j-case
Thermal resistance junction to case
(one powerstage in use)
Die must be
soldered on the
frame.
4.5 °C/W
R
thja
Thermal resistance junction-ambient pad layout 50 °C/W
R
thja
Thermal resistance junction-ambient
pad layout + 6 cm
2
on board heat sink
35 °C/W
ESD
ESD MIL 883C 2KV
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Supply Voltages
V
CC
Supply voltage -0.3 7 V
Outputs (Out 1 ... 4)
V
Out
Continues output voltage With no reverse
current.
-0.3 45 V
I
outc
Continues current 3.0 A
I
SCBpeak
Peak output current -10 I_SCB A
W
OFF
Clamped energy at the switching OFF For 2ms, see fig. 8 50 mJ
Inputs (NONx; NCS; CLK; NRES; SDI)
V
IN
Input voltage -0.3 7 V
Outputs (SDO; CFB)
V
OUT
Output voltage -0.3 V
CC
+0.3
V
Operating junction temperature
T
j
Operating junction temperature -40 150 °C
PIN FUNCTIONS (continued)
Pin No. Pin Name Pin Description Notes
