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NFM21HC101U1H3D
P1-P3
P4-P6
P7-P9
P10-P11
■
AEC-Q200 Murata Standard Specification and T
est Methods
Mechanical Pe
rformance (based on
Table 2 for Ta
ntalum & Cera
mic Capacitors)
AEC-Q200 Rev.C issued
June 17. 2005
Murata Specific
ation / Dev
iation
No.
Stress
Test Method
21
Board Flex
Appendix 2. Note:2mm
(min) for all
except 3mm
for class
1.
Meet Table B aft
er testing.
Deviation for
AEC-Q200;
It shall
be soldered on the
Glass-epoxy substrat
e (t =
1mm).
• Deflection :
2mm
• Keeping Time : 30s
22
Terminal Strength
Per AEC-Q200-006
A force of
1.8 kg
for 60 s
The electrode should s
how
no failure aft
er testing.
Deviation for
AEC-Q200;
It shall
be soldered on the
substrate.
• Applying Force : 17.6N
• Applying Time : 60s
23
Beam Load Test
Per AEC-Q200-003
The chip endure 20N.
Deviation for
AEC-Q200
Place the capac
itor in the
beam load fixture
as below figure.
Pressure Jig:
R0.5
Speed supplied the St
ress Load:
0.5mm/s
.
AEC-Q200
Iron
Board
4
5
R
23
0
F
D
e
flec
tion
4
5
P
rod
u
c
t
P
re
ss
ure
jig
0
.
6
0
.
8
1
.
6
1
.
0
JEMCPS-0309
3
4
■
AEC-Q200 Murata Standard Specification and T
est Methods
Mechanical Pe
rformance (based on
Table 2 for Ta
ntalum & Cera
mic Capacitors)
AEC-Q200 Rev.C issued
June 17. 2005
Table A
Appea
rance
No damag
e
Capacitance C
hange
W
ithin +/-7.5% at 20C
I.R.
1000M
Ω
min.
(22pF-470
000pF
)
500M
Ω
min. (1000000
pF)
DC Resistance(Rdc1,2)
0.5
Ω
max
(22pF-22
00pF)
0.05
Ω
max
(2200
0pF-100
0000
pF)
Tabe B
Appea
rance
No damag
e
Capacitance C
hange
W
ithin +/-12.5% at 20C
DC Resistance(Rdc1,2)
0.5
Ω
max
(22pF-22
00pF)
0.05
Ω
max
(2200
0pF-100
0000
pF)
Table C
Appea
rance
No damag
e
Capacitance
Meet initial value
(Shown in Ra
ted value
.)
DC Resistance(Rdc1,2)
0.5
Ω
max
(22pF-22
00pF)
0.05
Ω
max
(2200
0pF-100
0000
pF)
Table D
Appea
rance
No damag
e
Capacitance C
hange
W
ithin +/-12.5% at 20C
I.R.
1000M
Ω
min. (22pF-4700
00pF)
500M
Ω
min. (100
0000p
F)
DC Resistance(Rdc1,2)
0.5
Ω
max
(22pF-22
00pF)
0.05
Ω
max
(2200
0pF-100
0000
pF)
Table E
Murata PN
DC Resistance
(Rdc 1,2)
Value After Te
sting
(ohm) max
.
ESD Comp
onent
Classification
1C: 1kV(DC) to
<
2kV(DC)
NFM21HC
220U1
H3D
0.5
1C
NFM21HC
470U1
H3D
0.5
1C
NFM21HC
101U1
H3D
0.5
1C
NFM21HC
221R1
H3D
0.5
1C
NFM21HC
471R1
H3D
0.5
1C
NFM21HC
102R1
H3D
0.5
1C
NFM21HC
222R1
H3D
0.5
1C
NFM21HC
223R1
H3D
0.05
1C
NFM21HC
104R1
A3D
0.05
1C
NFM21HC
224R1
A3D
0.05
1C
NFM21HC
474R1
A3D
0.05
1C
NFM21HC
105R1
C3D
0.05
1C
JEMCPS-0309
3
5
1. Appearance an
d Dimension
s (8mm-wide pape
r tape)
(in mm)
2. Specification of
Taping
(1) Packing
quantity (standard quan
tity)
4000 pc
s. / reel
(2) Packing
Method
Products shall be pac
kaged in
the cavity of the
base tape and s
ealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket h
oles are to the rig
ht as the tape is
pulled toward the us
er.
(4) Base tape a
nd Top tape
The base tape an
d top tape have no splic
ed point.
(5) Cavity
There shall
not be burr in the
cavity.
(6) Missin
g componen
ts number
3. Pull Strength of Top Tape an
d Bottom Tape
5N min.
4. Peeling
off force of top tape
0.1N to 0.6N (minimu
m value is
typical)
Speed of Peeling
off : 300 mm /
min
5. Dimension
s of Leader-tape, Traile
r and Reel
There shall
be leader-tape (
top tape and empty tape) and trailer-tape (e
mpty tape) as follows.
(in mm)
Missing
components nu
mber within 0
.1% of the nu
mber per reel or 1
pc., whiche
ver is gre
ater,
and are not contin
uous.
The specifie
d quantity per ree
l is kept.
P A
C K
A G
I
N G
NFM
21
Ty
pe
F
16
5
to
180 deg
ree
To
p
tape
B
ottom tape
Ba
se tape
Em
pty tap
e
19
0
m
in.
Le
ade
r
T
railer
T
o
p t
ap
e
2
.0
±
0
.5
f
1
3
.0
±
0
.2
f
2
1
.0
±
0
.8
f
1
8
0±
f
6
0±
9
±
1
3±
1
.
4
1
0
0
3
D
irection o
f
fee
d
2
1
0 min.
16
0
m
in.
1
0
La
bel
JEMCPP-02232A
6
P1-P3
P4-P6
P7-P9
P10-P11
NFM21HC101U1H3D
Mfr. #:
Buy NFM21HC101U1H3D
Manufacturer:
Murata Electronics
Description:
Feed Through Capacitors 0805 100pF +/-20% 50 volt 700mA
Lifecycle:
New from this manufacturer.
Delivery:
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