6. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
Products shall be located in the sideways
direction (Length:a<b) to the mechanical stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully so that products are
not subject to the mechanical stress due to warping the board.
Because they may be subjected the mechanical stress in order
7. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
8. Reflow Soldering
• Standard printing pattern of solder paste.
1) Soldering paste printing for reflow
• Standard thickness of solder paste: 100µm to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
9. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Pre-heating : 150°C, 1 min • Soldering iron output : 30W max.
• Tip temperature : 350°C max. • Tip diameter : φ3mm max.
• Soldering time : 3(+1,-0) s • Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ceramic material due to the thermal shock.
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
b
150°C ~ 180°C , 90s ± 30s
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
～
60s
60s max.
180
150
Temp.
Time.(s)
(°C)
