CY7C1347F
Document #: 38-05213 Rev. *C Page 7 of 19
WRITE Cycle, Suspend Burst Current X X X L H H H L X L-H D
WRITE Cycle, Suspend Burst Current H X X L X H H L X L-H D
Partial Truth Table for Read/write
[2, 7]
Function
GW BWE
BW
D
BW
C
BW
B
BW
A
Read HHXXXX
Read HLHHHH
Write Byte A DQ
A
HLHHHL
Write Byte B – DQ
B
HLHHLH
Write Bytes B, A H L H H L L
Write Byte C– DQ
C
HLHLHH
Write Bytes C, A H L H L H L
Write Bytes C, B H L H L L H
Write Bytes C, B, A H L H L L L
Write Byte D– DQ
D
HL LHHH
Write Bytes D, A H L L H H L
Write Bytes D, B H L L H L H
Write Bytes D, B, A H L L H L L
Write Bytes D, C H L L L H H
Write Bytes D, C, A H L L L H L
Write Bytes D, C, B HLLLLH
Write All Bytes HLLLLL
Write All Bytes LXXXXX
Notes:
7. Table only lists a partial listing of the byte write combinations. Any combination of BW
[A:D]
is valid. Appropriate write will be done based on which byte write is active.
Truth Table
[2, 3, 4, 5, 6]
Next Cycle
Add.
Used ZZ
CE
3
CE
2
CE
1
ADSP ADSC ADV
WRITE
OE CLK
DQ
CY7C1347F
Document #: 38-05213 Rev. *C Page 8 of 19
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ..................................... 65°C to +150°C
Ambient Temperature with
Power Applied.................................................. 55°C to +125°C
Supply Voltage on V
DD
Relative to GND .........0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State ........................................... 0.5V to V
DD
+ 0.5V
DC Input Voltage ....................................... −0.5V to V
DD
+ 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA
Operating Range
Range
Ambient
Temperature V
DD
V
DDQ
Com’l 0°C to +70°C 3.3V
5%/+10%
2.5V 5%
to V
DD
Ind’l –40°C to +85°C
Electrical Characteristics
Over the Operating Range
[8, 9]
Parameter Description Test Conditions Min. Max. Unit
V
DD
Power Supply Voltage 3.135 3.6 V
V
DDQ
I/O Supply Voltage 2.375 V
DD
V
V
OH
Output HIGH Voltage V
DDQ
= 3.3V, V
DD
= Min., I
OH
= –4.0 mA 2.4 V
V
DDQ
= 2.5V, V
DD
= Min., I
OH
= –2.0 mA 2.0 V
V
OL
Output LOW Voltage V
DDQ
= 3.3V, V
DD
= Min., I
OL
= 8.0 mA 0.4 V
V
DDQ
= 2.5V, V
DD
= Min., I
OL
= 2.0 mA 0.7 V
V
IH
Input HIGH Voltage
[8]
V
DDQ
= 3.3V 2.0 V
DD
+ 0.3V V
V
DDQ
= 2.5V 1.7 V
DD
+ 0.3V V
V
IL
Input LOW Voltage
[8]
V
DDQ
= 3.3V –0.3 0.8 V
V
DDQ
= 2.5V –0.3 0.7 V
I
X
Input Load Current ex-
cept ZZ and MODE
GND V
I
V
DDQ
5 5 µA
Input Current of MODE Input = V
SS
30 µA
Input = V
DDQ
5 µA
Input Current of ZZ Input = V
SS
5 µA
Input = V
DDQ
30 µA
I
OZ
Output Leakage Current GND V
I
V
DDQ,
Output Disabled 5 5 µA
I
DD
V
DD
Operating Supply
Current
V
DD
= Max., I
OUT
= 0 mA,
f = f
MAX
= 1/t
CYC
4-ns cycle, 250 MHz 325 mA
4.4-ns cycle, 225 MHz 290 mA
5-ns cycle, 200 MHz 265 mA
6-ns cycle, 166 MHz 240 mA
7.5-ns cycle, 133 MHz 225 mA
10-ns cycle, 100 MHz 205 mA
I
SB1
Automatic CE
Power-down
Current—TTL Inputs
Max. V
DD
, Device Deselected,
V
IN
V
IH
or V
IN
V
IL
f = f
MAX
= 1/t
CYC
4-ns cycle, 250 MHz 120 mA
4.4-ns cycle, 225 MHz 115 mA
5-ns cycle, 200 MHz 110 mA
6-ns cycle, 166 MHz 100 mA
7.5-ns cycle, 133 MHz 90 mA
10-ns cycle, 100 MHz 80 mA
I
SB2
Automatic CE
Power-down
Current—CMOS Inputs
Max. V
DD
, Device Deselected,
V
IN
0.3V or V
IN
> V
DDQ
– 0.3V, f
= 0
All speeds 40 mA
Notes:
8. Overshoot: V
IH
(AC) < V
DD
+1.5V (Pulse width less than t
CYC
/2), undershoot: V
IL
(AC) > -2V (Pulse width less than t
CYC
/2).
9. T
Power-up
: Assumes a linear ramp from 0v to V
DD
(min.) within 200ms. During this time V
IH
< V
DD
and V
DDQ
< V
DD
CY7C1347F
Document #: 38-05213 Rev. *C Page 9 of 19
I
SB3
Automatic CE
Power-down
Current—CMOS Inputs
Max. V
DD
, Device Deselected, or
V
IN
0.3V or V
IN
> V
DDQ
– 0.3V
f = f
MAX
= 1/t
CYC
4-ns cycle, 250 MHz 105 mA
4.4-ns cycle, 225 MHz 100 mA
5-ns cycle, 200 MHz 95 mA
6-ns cycle, 166 MHz 85 mA
7.5-ns cycle, 133 MHz 75 mA
10-ns cycle, 100 MHz 65 mA
I
SB4
Automatic CE
Power-down
Current—TTL Inputs
Max. V
DD
, Device Deselected,
V
IN
V
IH
or V
IN
V
IL
, f = 0
45 mA
Shaded areas contain advance information.
Capacitance
[10]
Parameter Description Test Conditions
TQFP
Package
BGA
Package
fBGA
Package
Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1
MHz,
V
DD
= 3.3V.
V
DDQ
= 3.3V
5 5 5 pF
C
CLK
Clock Input Capacitance 5 5 5 pF
C
I/O
Input/Output Capacitance 5 7 7 pF
AC Test Loads and Waveforms
Thermal Resistance
[10]
Parameter Description Test Conditions
TQFP
Package
BGA
Package
fBGA
Package Unit
Q
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA / JESD51.
41.83 47.63 20.3 °C/W
Q
JC
Thermal Resistance
(Junction to Case)
9.99 11.71 4.6 °C/W
Note:
10. Tested initially and after any design or process changes that may affect these parameters.
Electrical Characteristics
Over the Operating Range (continued)
[8, 9]
Parameter Description Test Conditions Min. Max. Unit
OUTPUT
R = 317
R = 351
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
L
= 1.5V
3.3V
ALL INPUT PULSES
V
DD
GND
90%
10%
90%
10%
1ns
1ns
(c)
OUTPUT
R = 1667
R =1538
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R
L
= 50
Z
0
= 50
V
L
= 1.25V
2.5V
ALL INPUT PULSES
V
DD
GND
90%
10%
90%
10%
1ns
1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load

CY7C1347F-133AC

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 4.5M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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