NCP81071
www.onsemi.com
14
PACKAGE DIMENSIONS
WDFN8 3x3, 0.65P
CASE 511CD
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
L
D2
E2
C
C0.10
C0.05
C0.05
A1
SEATING
PLANE
8X
NOTE 3
b
8X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
b 0.25 0.35
D 3.00 BSC
D2 2.05 2.25
E 3.00 BSC
E2 1.10 1.30
e 0.65 BSC
L 0.30 0.50
1
4
8
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
PITCH
1.36
3.30
1
DIMENSIONS: MILLIMETERS
0.63
8X
NOTE 4
0.40
8X
DETAIL A
A3 0.20 REF
A3
A
DETAIL B
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 0.00 0.15
OUTLINE
PACKAGE
e
RECOMMENDED
K
5
2.31
e/2
K
0.20 −−−
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NCP81071/D
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