AD811 Data Sheet
Rev. G | Page 20 of 20
Figure 53. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD811ANZ −40°C to +85°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8
AD811AR-16 −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
AD811ARZ-16 −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
AD811ARZ-16-REEL −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
AD811ARZ-16-REEL7 −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W] RW-16
AD811JR-EBZ 8-Lead SOIC Evaluation Board
AD811JRZ 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
AD811JRZ-REEL7 0°C to +70°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
AD811SQ/883B −55°C to +125°C 8-Lead Ceramic Dual In-Line Package [CERDIP] Q-8
AD811SE/883B −55°C to +125°C 20-Terminal Ceramic Leadless Chip Carrier [LCC] E-20-1
AD811ACHIPS −40°C to +85°C DIE
AD811SCHIPS −55°C to +125°C DIE
1
Z = RoHS Compliant Part.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AA
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0
.
7
5
(
0
.
0
2
9
5
)
0
.
2
5
(
0
.
0
0
9
8
)
45°
1.27 (0.0500)
0.40 (0.0157)
OPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
16
9
8
1
1.27 (0.0500)
BSC
03-27-2007-B
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00866-0-4/15(G)
