SI5853DDC-T1-E3

Vishay Siliconix
Si5853DDC
Document Number: 68979
S10-0548-Rev. B, 08-Mar-10
www.vishay.com
1
P-Channel 20 V (D-S) MOSFET with Schottky Diode
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
LITTLE FOOT
®
Plus Schottky Power MOSFET
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Charging Switch for Portable Devices
- With Integrated Low V
f
Trench Schottky Diode
MOSFET PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
- 20
0.105 at V
GS
= - 4.5 V
- 4
a
4.7 nC
0.143 at V
GS
= - 2.5 V
- 3.8
0.188 at V
GS
= - 1.8 V
- 3
SCHOTTKY PRODUCT SUMMARY
V
KA
(V)
V
f
(V)
Diode Forward Voltage
I
F
(A)
20 0.46 at 0.5 A 1
Bottom View
1206-8 ChipFET
®
A
A
S
G
K
K
D
D
1
Marking Code
JH XX
Lot Traceability
and Date Code
Part # Code
Ordering Information: Si5853DDC-T1-E3 (Lead (Pb)-free)
Si5853DDC-T1-GE3 (Lead (Pb)-free and Halogen-free)
K
A
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage (MOSFET) V
DS
- 20
VReverse Voltage (Schottky) V
KA
20
Gate-Source Voltage (MOSFET) V
GS
± 8
Continuous Drain Current (T
J
= 150 °C) (MOSFET)
T
C
= 25 °C
I
D
- 4
a
A
T
C
= 70 °C
- 3.5
T
A
= 25 °C
- 2.9
b, c
T
A
= 70 °C
- 2.3
b, c
Pulsed Drain Current (MOSFET) I
DM
- 10
Continuous Source Current (MOSFET Diode Conduction)
T
C
= 25 °C
I
S
- 2.6
T
A
= 25 °C
- 1.1
b, c
Average Forward Current (Schottky) I
F
1
Pulsed Forward Current (Schottky) I
FM
3
Maximum Power Dissipation (MOSFET)
T
C
= 25 °C
P
D
3.1
W
T
C
= 70 °C 2
T
A
= 25 °C
1.3
b, c
T
A
= 70 °C
0.8
b, c
Maximum Power Dissipation (Schottky)
T
C
= 25 °C 2.5
T
C
= 70 °C 1.6
T
A
= 25 °C 1.2
T
A
= 70 °C 0.76
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendation (Peak Temperature)
d, e
260
www.vishay.com
2
Document Number: 68979
S10-0548-Rev. B, 08-Mar-10
Vishay Siliconix
Si5853DDC
Notes:
a. Package limited.
b. Surface mounted on FR4 board.
c. t 5 s.
d. See Solder Profile (www.vishay.com/doc?73257
). The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f .Maximum under steady state conditions for MOSFETs is 130 °C/W.
g. Maximum under steady state conditions for Schottky is 125 °C/W.
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient (MOSFET)
b, c, f
R
thJA
77 95
°C/W
Maximum Junction-to-Foot (Drain) (MOSFET)
R
thJF
33 40
Maximum Junction-to-Ambient (Schottky)
b, c, g
R
thJA
85 105
Maximum Junction-to-Foot (Drain) (Schottky)
R
thJF
40 50
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 20 V
V
DS
Temperature Coefficient ΔV
DS/TJ
I
D
= - 250 µA
- 13
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)/TJ
2.4
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.4 - 1 V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 20 V, V
GS
= 0 V
- 1
µA
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 85 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 4.5 V
- 10 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 2.9 A
0.085 0.105
Ω
V
GS
= - 2.5 V, I
D
= - 2.5 A
0.117 0.143
V
GS
= - 1.8 V, I
D
= - 1.5 A
0.155 0.188
Forward Transconductance
a
g
fs
V
DS
= - 10 V, I
D
= - 2.9 A
7S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
320
pFOutput Capacitance
C
oss
60
Reverse Transfer Capacitance
C
rss
47
Total Gate Charge
Q
g
V
DS
= - 10 V, V
GS
= - 8 V, I
D
= - 2.9 A
7.9 12
nC
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 2.9 A
4.7 7.1
Gate-Source Charge
Q
gs
0.65
Gate-Drain Charge
Q
gd
1.35
Gate Resistance
R
g
f = 1 MHz 6.5 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 4.4 Ω
I
D
- 2.3 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
15 25
ns
Rise Time
t
r
17 30
Turn-Off Delay Time
t
d(off)
21 30
Fall Time
t
f
10 15
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 4.4 Ω
I
D
- 2.3 A, V
GEN
= - 8 V, R
g
= 1 Ω
510
Rise Time
t
r
10 15
Turn-Off Delay Time
t
d(off)
20 30
Fall Time
t
f
10 15
Document Number: 68979
S10-0548-Rev. B, 08-Mar-10
www.vishay.com
3
Vishay Siliconix
Si5853DDC
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 2.6
A
Pulse Diode Forward Current
I
SM
- 10
Body Diode Voltage
V
SD
I
S
= - 2.3 A, V
GS
= 0 V
- 0.85 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 2.3 A dI/dt = 100 A/µs T
J
= 25 °C
15 30 ns
Body Diode Reverse Recovery Charge
Q
rr
920nC
Reverse Recovery Fall Time
t
a
10
ns
Reverse Recovery Rise Time
t
b
5
SCHOTTKY SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Forward Voltage Drop
V
F
I
F
= 0.5 A
0.381 0.46
V
I
F
= 1 A
0.468 0.560
I
F
= 1 A, T
J
= 125 °C
0.44 0.53
Maximum Reverse Leakage Current
I
rm
V
r
= 5 V
0.0081 0.080
mA
V
r
= 5 V, T
J
= 85 °C
0.4 4
V
r
= 5 V, T
J
= 125 °C
2.8 28
V
r
= 20 V
0.0093 0.09
V
r
= 20 V, T
J
= 85 °C
0.45 4.5
V
r
= 20 V, T
J
= 125 °C
3.2 32
Junction Capacitance
C
T
V
r
= 10 V
30 pF

SI5853DDC-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -20V Vds 8V Vgs 1206-8 ChipFET
Lifecycle:
New from this manufacturer.
Delivery:
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