LQW15AN4N3B00D Datasheet LQW15AN4N1D00D, LQW15AN12NH00D, LQW15AN30NH00D | P10-P12

Spec No.JELF243A-0050AA-01 P.10/14

MURATA MFG.CO.,LTD

Reference Only

11.2 Flux, Solder

・

Use rosin-based flux.

Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.

Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).

Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 100μm to 150μm.

11.3 Reflow soldering conditions

・

Pre-heating should be in such a way that the temperature difference between solder and product

surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way

that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products

quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

・Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150°C～180°C 、90s±30s

Heating above 220°C､30s～60s above 230°C､60s max.

Peak temperature 245°C±3°C 260°C,10s

Cycle of reflow 2 times 2 times

11.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter φ3mm max.

Soldering time 3(+1,-0)s

Time 2 times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

11.5 Solder Volume

・

Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T

≦t≦T

：thickness of product

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

Recommendable(t)

Upper Limit

⇔

Recommendable(t)

Upper Limit

⇔

Spec No.JELF243A-0050AA-01 P.11/14

MURATA MFG.CO.,LTD

Reference Only

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a

＜b) to the mechanical

stress.

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1

(2) Add slits in the board separation part. A > B

(3) Keep the mounting position of the component away from the board separation surface. A > C

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.

〈

Poor example

〉

〈

Good example

〉

Seam

Slit

Length:a

Spec No.JELF243A-0050AA-01 P.12/14

MURATA MFG.CO.,LTD

Reference Only

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,

or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine

by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted

on your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched

to the winding portion to prevent the

breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

11.10 Notice of product handling at mounting

In some mounting machines,when picking up components support pin pushes up the components from the

bottom of base tape. In this case, please remove the support pin. The support pin may damage the

components and break wire.

In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser

recognition. (There is no problem with the permeation and reflection type.)

11.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

P1-P3 P4-P6 P7-P9 P10-P12 P13-P14

LQW15AN4N3B00D

Mfr. #:

Buy LQW15AN4N3B00D

Manufacturer:

Murata Electronics

Description:

Fixed Inductors 4.3 NH +-.1NH

Lifecycle:

New from this manufacturer.

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LQW15AN4N3B00D

LQW15AN4N3B00D

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