Data Sheet ADGM1004
Rev. A | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 2.
Parameter Rating
V
to GND −0.3 V to +6 V
Digital Inputs
−0.3 V to V
DD
+ 0.3 V or 30 mA
(whichever occurs first)
DC Voltage Rating
2
±10 V
Current Rating
2
250 mA
3
Operating Temperature Range
Storage Temperature Range −65°C to +150°C
Reflow Soldering (Pb-Free)
Peak Temperature 260 (+0/−5)°C
Time at Peak Temperature 10 sec to 30 sec
ESD
Human Body Model
RF1 to RF4 and RFC Pins 5 kV
All Other Pins 2.5 kV
Field Induced Charged Device
Model
4
Group D
Mechanical Shock
1500 g with 0.5 ms pulse
Vibration 20 Hz to 2000 Hz acceleration at
50 g
Constant Acceleration 30,000 g
1
Clamp overvoltages at INx by internal diodes. Limit the current to the
maximum ratings given.
2
This rating is with respect to the switch in the on position with no radio
frequency signal applied.
3
This rating is with respect to the switch in the on position and terminated
into 50 Ω. The rating is 27 dBm when the switch is unterminated.
4
A safe automated handling and assembly process is achieved at this rating
level by implementing industry-standard ESD controls.
5
If the device is dropped during handling, do not use the device.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating can be applied at any one
time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θ
JC
is the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
θ
Unit
CP-24-4
60 75 °C/W
1
A simulated θ
JA
number is evaluated using the maximum junction
temperature in the package and the total power being dissipated in the
package under operating conditions. For thermal performance calculation
purposes at 25°C, a power dissipation of 113 mW per switch can be used.
This value is calculated from a typical R
ON
of 1.8 Ω and an absolute maximum
current rating of 250 mA.
ESD CAUTION