ADGM1004 Data Sheet
Rev. A | Page 6 of 20
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
IN1
IN2
IN3
IN4
EP1 EP2
GND
NOTES
1. EXPOSED PAD 1. EP1 IS INTERNALLY CONNECTED
T
O EP2
AND MUST BE CONNECTED TO GND.
2. EXPOSED PAD 2. EP2 IS INTERNALLY CONNECTED TO EP1
AND MUST BE CONNECTED TO GND.
GND
GND
RFC
GND
GND
1
2
3
4
5
17
16
15
14
13
GND
EXTD_EN
GND
GND
RF4
6
7
8
9
10
GND
11
RF3
V
CP
V
DD
GND
GND
RF1
GND
RF2
12
24
23
22
21
20
19
18
ADGM1004
TO
P VIEW
(Not to Scale)
15173-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 IN1 Digital Control Input 1. The voltage applied to this pin controls the gate of the MEMS switch, RF1 to RFC.
If IN1 is low, RF1 to RFC is open (off). If IN1 is high, connect RF1 to RFC (on).
2 IN2 Digital Control Input 2. The voltage applied to this pin controls the gate of the MEMS switch, RF2 to RFC.
If IN2 is low, RF2 to RFC is open (off). If IN2 is high, connect RF2 to RFC (on).
3 IN3 Digital Control Input 3. The voltage applied to this pin controls the gate of the MEMS switch, RF3 to RFC.
If IN3 is low, RF3 to RFC is open (off ). If IN3 is high, connect RF3 to RFC (on).
4 IN4 Digital Control Input 4. The voltage applied to this pin controls the gate of the MEMS switch, RF4 to RFC.
If IN4 is low, RF4 to RFC is open (off). If IN4 is high, connect RF4 to RFC (on).
5, 6, 8, 9, 11,
13, 14, 16, 17,
19, 21, 22
GND Ground Connection.
7 EXTD_EN External Voltage Drive Enable. In normal operation, set EXTD_EN low to enable the built in 11.5 MHz
oscillator to enable the internal driver IC voltage boost circuitry. Setting EXTD_EN high disables the
internal 11.5 MHz oscillator and driver boost circuitry. Disabling the internal oscillator eliminates the
associated 11.5 MHz noise feedthrough into the switch. With the oscillator disabled, the switch can still be
controlled via the logic interface pins (IN1 to IN4) but the V
CP
pin must to be driven with 80 V dc from an external
voltage supply.
10 RF4 RF4 Port. This pin can be an input or an output. If unused, the pin must be connected to GND.
12 RF3 RF3 Port. This pin can be an input or an output. If unused, the pin must be connected to GND.
15 RFC Common RF Port. This pin can be an input or an output.
18 RF2 RF2 Port. This pin can be an input or an output. If unused, the pin must be connected to GND.
20 RF1 RF1 Port. This pin can be an input or an output. If unused, the pin must be connected to GND.
23 V
DD
Positive Power Supply Input. For the recommend input voltage for this chip, see the Specifications section.
Then, boost up this voltage internally to generate the voltage required to turn on the MEMS switch.
24 V
CP
Charge Pump Capacitor Terminal. The recommended shunt capacitor to ground value is 47 pF. If Pin 7 is
high, an 80 V dc drive voltage must be input into V
CP
to drive the switches.
EP1 Exposed Pad 1. EP1 is internally connected to EP2 and must be connected to GND.
EP2
Exposed Pad 2. EP2 is internally connected to EP1 and must be connected to GND.
Data Sheet ADGM1004
Rev. A | Page 7 of 20
TYPICAL PERFORMANCE CHARACTERISTICS
For Figure 12, Figure 13, and Figure 14, T50 refers to the number of cycles for 50% of the population to fail.
10M
100M 1G
10G
100G
INSERTION LOSS (dB)
FREQUENCY (Hz)
RF2 TO RFC
RF1
TO RFC
T
A
= 25°C
V
DD
= 3.3V
15173-003
Figure 3. Insertion Loss vs. Frequency (V
DD
= 3.3 V)
100M 1G 10G 100G
INSERTION LOSS (dB)
FREQUENCY
(Hz)
85°C
25°C
0°C
15173-004
Figure 4. Insertion Loss vs. Frequency over Temperature (V
DD
= 3.3 V, RF1 to RFC)
0 2 4 6 8 10 12 14 16
INSERTION LOSS (dB)
FREQUENCY (GHz)
RF2 TO RFC
RF1 TO RFC
15173-006
T
A
= 25°C
V
DD
= 3.3V
Figure 5. Insertion Loss vs. Frequency Linear Scale (V
DD
= 3.3 V)
–80
–70
–60
–50
–40
–30
–20
–10
0
–0.50
–0.45
–0.40
–0.35
–0.30
–0.25
–0.20
–0.15
–0.10
–0.05
0
0 50 100 150 200
OFF ISOLATION/RETURN LOSS (dB)
INSERTION LOSS (dB)
FREQUENCY (MHz)
INSERTION LOSS
OFF ISOLATION
RETURN LOSS
T
A
= 25°C
V
DD
= 3.3V
15173-005
Figure 6. Low Frequency Insertion Loss and Off Isolation/Return Loss vs.
Frequency (V
DD
= 3.3 V, RF1 to RFC)
0 1 2 3 4 6 7 8 95 10
OFF ISOLATION (dB)
FREQUENCY (GHz)
T
A
= 25°C
V
DD
= 3.3V
RF1 TO RFC
RF2 TO RFC
15173-007
Figure 7. Off Isolation vs. Frequency (V
DD
= 3.3 V)
OFF ISOLATION (dB)
0 1 2 3 4 6 7 8 95 10
FREQUENCY (GHz)
15173-008
V
DD
= 3.3V
T
A
= 85°C
T
A
= 25°C
T
A
= 0°C
Figure 8. Off Isolation vs. Frequency over Temperature (V
DD
= 3.3 V, RF1 to RFC)
ADGM1004 Data Sheet
Rev. A | Page 8 of 20
0 1 2 3 4 6 7 8 95 10
RETURN LOSS (dB)
FREQUENCY (GHz)
T
A
= 25°C
V
DD
= 3.3V
15173-010
RF1
RF2
RFC (RF1 ON)
Figure 9. Return Loss vs. Frequency (V
DD
= 3.3 V)
CROSSTALK (dB)
0 1 2 3 4 6 7 8 95 10
FREQUENCY (GHz)
15173-009
T
A
= 25°C
V
DD
= 3.3V
RF1 TO RF2
RF2 TO RF1
Figure 10. Crosstalk vs. Frequency (V
DD
= 3.3 V)
0 1 2 3 4
6 7 8 95 10
FREQUENCY (GHz)
12874-011
V
DD
= 3.3V
T
A
= 85°C
T
A
= 25°C
T
A
= 0°C
Figure 11. Crosstalk vs. Frequency over Temperature (V
DD
= 3.3 V, RF2 to RF1)
10M 100M 1B
SWITCH ACTUATIONS (Cycles)
UNRELIABLE (% OF POPULATION)
10B 100B
98
94
90
82
65
T50
45
25
14
8
4
1
15173-215
Figure 12. Log Normal Failure Probability with 95% Confidence Interval (CI)
Indicated for Hot Switching a 10 dBm Continuous Wave (CW) Terminated
into 50 Ω, T
A
= 25°C, V
DD
= 3.3 V
1k 10k 100k 1M 10M
SWITCH ACTUATIONS (Cycles)
UNRELIABLE (% OF POPULATION)
100M 1G
98
94
90
82
65
T50
45
25
14
8
4
1
15173-216
Figure 13. Log Normal Failure Probability with 95% CI Indicated for Hot
Switching a 15 dBm CW Terminated into 50 Ω , T
A
= 25°C, V
DD
= 3.3 V
SWITCH ACTUATIONS (Cycles)
UNRELIABLE (% OF POPULATION)
98
94
90
82
65
T50
45
25
14
8
4
1
15173-217
1k 10k 100k 1M 10M 100M 1G
Figure 14. Log Normal Failure Probability with 95% CI Indicated for Hot
Switching a 20 dBm CW Terminated into 50 Ω, T
A
= 25°C, V
DD
= 3.3 V

ADGM1004JCPZ-R2

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs >1kV HBM ESD MEMS Switch Solution
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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