NX3DV2567_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 20 January 2014 13 of 19
NXP Semiconductors NX3DV2567-Q100
Low-ohmic four-pole double-throw analog switch
12.2 Additional dynamic characteristics
[1] f
i
is biased at 0.5V
CC
.
12.3 Test circuits
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); V
I
= GND or V
CC
(unless otherwise
specified); t
r
= t
f
2.5 ns; T
amb
= 25
C.
Symbol Parameter Conditions Min Typ Max Unit
Data path switch
f
(3dB)
3 dB frequency
response
R
L
=50; see Figure 16
[1]
V
CC
= 2.7 V to 3.6 V - 330 - MHz
iso
isolation (OFF-state) f
i
=10MHz; R
L
=50; see Figure 17
[1]
V
CC
= 2.7 V to 3.6 V - 60 - dB
Xtalk crosstalk between switches;
f
i
=10MHz;R
L
=50;seeFigure 18
[1]
V
CC
= 2.7 V to 3.6 V - 60 - dB
Q
inj
charge injection f
i
= 1 MHz; C
L
= 0.1 nF; R
L
=1 M; V
gen
=0V;
R
gen
=0; see Figure 19
V
CC
= 2.7 V to 3.6 V - 10 - pC
To obtain 0 dBm level at output, adjust f
i
voltage. Increase f
i
frequency until dB meter reads 3dB.
Fig 16. Test circuit for measuring the frequency response when channel is in ON-state
dB
001aam609
S
nZ
GND
nY0
V
IL
or V
IH
nY1
switch
1
2
Sswitch
V
IL
1
V
IH
2
f
i
R
L
V
CC
0.5V
CC
To obtain 0 dBm level at input, adjust f
i
voltage.
Fig 17. Test circuit for measuring isolation (OFF-state)
dB
001aam610
S
nZ
GND
nY0
V
IL
or V
IH
nY1
switch
1
2
Sswitch
V
IH
1
V
IL
2
f
i
R
L
V
CC
0.5V
CC
R
L
0.5V
CC
NX3DV2567_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 20 January 2014 14 of 19
NXP Semiconductors NX3DV2567-Q100
Low-ohmic four-pole double-throw analog switch
20 log
10
(V
O2
/ V
O1
) or 20 log
10
(V
O1
/ V
O2
).
Fig 18. Test circuit for measuring crosstalk between switches
V
001aam611
R
L
f
i
V
O2
0.5V
CC
V
R
L
R
i
50 Ω
50 Ω V
O1
0.5V
CC
CHANNEL
ON
nZ or nY0
nZ or nY0
nY0 or nZ
nY0 or nZ
S
V
IL
CHANNEL
OFF
a. Test circuit
b. Input and output pulse definitions
Definition: Q
inj
= V
O
C
L
.
V
O
= output voltage variation.
R
gen
= generator resistance.
V
gen
= generator voltage.
Fig 19. Test circuit for measuring charge injection
001aam612
S
nZ
GND
nY0
nY1
V
V
O
C
L
R
L
R
gen
V
I
V
gen
V
CC
G
switch
1
2
001aam613
ΔV
O
offonoff
logic
input
V
O
(S)
NX3DV2567_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 20 January 2014 15 of 19
NXP Semiconductors NX3DV2567-Q100
Low-ohmic four-pole double-throw analog switch
13. Package outline
Fig 20. Package outline SOT1039-1 (HXQFN16U)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT1039-1 - - -- - -
SOT1039-1
07-11-14
07-12-01
UNIT
A
max
mm 0.5
0.05
0.00
0.35
0.25
1.95
1.75
3.1
2.9
1.95
1.75
0.5 1.5
0.35
0.25
0.1
A
1
DIMENSIONS (mm are the original dimensions)
HXQFN16U: plastic thermal enhanced extremely thin quad flat package; no leads;
16 terminals; UTLP based; body 3 x 3 x 0.5 mm
0 2.5 5 mm
scale
b D
3.1
2.9
D
h
E E
h
e e
1
1.5
e
2
L L
1
0.1
0.0
v w
0.05
y
0.05
y
1
0.1
C
y
C
y
1
X
b
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
v
M
Cw
M
terminal 1
index area
D
h
E
h
L
1
L
9
8
1316
12
4
1
5
B
A
terminal 1
index area
D
E
detail X
A
1
A

NX3DV2567HR-Q100X

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Analog Switch ICs Low-ohmic four-pole analog switch
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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