Nexperia
PMPB20SNA
40 V, N-channel Trench MOSFET
PMPB20SNA All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Preliminary data sheet 19 July 2017 5 / 14
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] - 223 256 K/WR
th(j-a)
thermal resistance
from junction to
ambient
in free air
[2] - 57 66 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
- 5 10 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm
2
.
aaa-026869
t
p
(s)
10
-3
10
3
10
2
10110
-1
10
-2
10
3
Z
th(j-a)
(K/W)
1
10
10
2
duty cycle = 1
0.02
0.01
0
0.5
0.75
0.33
0.25
0.2
0.1
0.05
FR4 PCB, standard footprint
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-026870
t
p
(s)
10
-3
10
3
10
2
10110
-1
10
-2
10
2
10
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.02
0.01
0
0.05
0.1
0.2
0.25
0.33
0.5
0.75
FR4 PCB, mounting pad for drain 6 cm
2
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
