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LPC2368FBD100,551

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 61 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
15. Package outline
Fig 25. Package outline SOT407-1 (LQFP100)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.25
15.75
1.15
0.85
7
0
o
o
0.08 0.080.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1 136E20 MS-026
00-02-01
03-02-20
D
(1) (1)(1)
14.1
13.9
H
D
16.25
15.75
E
Z
1.15
0.85
D
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
25
c
D
H
b
p
E
H
A
2
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
100
76
75
51
50
26
y
pin 1 index
w M
w M
0 5 10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 62 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Fig 26. Package outline SOT926-1 (TFBGA100)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT926-1 - - - - - - - - -
SOT926-1
05-12-09
05-12-22
UNIT
A
max
mm 1.2
0.4
0.3
0.8
0.65
0.5
0.4
9.1
8.9
9.1
8.9
A
1
DIMENSIONS (mm are the original dimensions)
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
A
2
b D E e
2
7.2
e
0.8
e
1
7.2
v
0.15
w
0.05
y
0.08
y
1
0.1
0 2.5 5 mm
scale
b
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
∅ v
M
C∅ w
M
ball A1
index area
A
B
C
D
E
F
H
K
G
J
24681013579
ball A1
index area
B A
E
D
C
y
C
y
1
X
detail X
A
A
1
A
2
LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7.1 — 16 October 2013 63 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
16. Abbreviations
Table 19. Abbreviations
Acronym Description
ADC Analog-to-Digital Converter
AHB Advanced High-performance Bus
AMBA Advanced Microcontroller Bus Architecture
APB Advanced Peripheral Bus
BOD BrownOut Detection
CAN Controller Area Network
DAC Digital-to-Analog Converter
DCC Debug Communication Channel
DMA Direct Memory Access
DSP Digital Signal Processing
EOP End Of Packet
ETM Embedded Trace Macrocell
GPIO General Purpose Input/Output
IrDA Infrared Data Association
JTAG Joint Test Action Group
MII Media Independent Interface
MIIM Media Independent Interface Management
PHY Physical Layer
PLL Phase-Locked Loop
PWM Pulse Width Modulator
RMII Reduced Media Independent Interface
SE0 Single Ended Zero
SPI Serial Peripheral Interface
SSI Serial Synchronous Interface
SSP Synchronous Serial Port
TTL Transistor-Transistor Logic
UART Universal Asynchronous Receiver/Transmitter
USB Universal Serial Bus
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69

LPC2368FBD100,551

Mfr. #:
Buy LPC2368FBD100,551
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 512KF/USB/ENET
Lifecycle:
New from this manufacturer.
Delivery:
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