13
AT24C32A/64A
3054N–SEEPR–2/04
Note: For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.
AT24C32A Ordering Information
Ordering Code Package Operation Range
AT24C32A-10PI-2.7
AT24C32AN-10SI-2.7
AT24C32AW-10SI-2.7
AT24C32A-10TI-2.7
AT24C32AY1-10YI-2.7
8P3
8S1
8S2
8A2
8Y1
Industrial Temperature
(-40° C to 85° C)
AT24C32A-10PI-1.8
AT24C32AN-10SI-1.8
AT24C32AW-10SI-1.8
AT24C32A-10TI-1.8
AT24C32AY1-10YI-1.8
8P3
8S1
8S2
8A2
8Y1
Industrial Temperature
(-40° C to 85° C)
AT24C32AN-10SU-2.7
AT24C32AN-10SU-1.8
AT24C32A-10TU-2.7
AT24C32A-10TU-1.8
8S1
8S1
8A2
8A2
Lead-free/Halogen-free/
Industrial Temperature
(-40° C to 85° C)
AT24C32AN-10SQ-2.7 8S1
Lead-free/Halogen-free/
High Grade/Extended Temperature
(-40° C to 125° C))
AT24C32AN-10SE-2.7 8S1
High Grade/Extended Temperature
(-40° C to 125° C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2 8-lead, 0.209" Body, Plastic Small Outline (EIAJ SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
Options
-2.7 Low Voltage (2.7V to 5.5V)
-1.8 Low Voltage (1.8V to 5.5V)
14
AT24C32A/64A
3054N–SEEPR–2/04
Note: For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.
AT24C64A Ordering Information
Ordering Code Package Operation Range
AT24C64A-10PI-2.7
AT24C64AN-10SI-2.7
AT24C64AW-10SI-2.7
AT24C64A-10TI-2.7
AT24C64AY1-10YI-2.7
8P3
8S1
8S2
8A2
8Y1
Industrial Temperature
(-40° C to 85° C)
AT24C64A-10PI-1.8
AT24C64AN-10SI-1.8
AT24C64AW-10SI-1.8
AT24C64A-10TI-1.8
AT24C64AY1-10YI-1.8
8P3
8S1
8S2
8A2
8Y1
Industrial Temperature
(-40° C to 85° C)
AT24C64AN-10SU-2.7
AT24C64AN-10SU-1.8
AT24C64A-10TU-2.7
AT24C64A-10TU-1.8
8S1
8S1
8A2
8A2
Lead-free/Halogen-free/
Industrial Temperature
(-40° C to 85° C)
AT24C64AN-10SQ-2.7 8S1
Lead-free/Halogen-free/
High Grade/Extended Temperature
(-40° C to 125° C))
AT24C64AN-10SE-2.7 8S1
High Grade/Extended Temperature
(-40° C to 125° C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2 8-lead, 0.209" Body, Plastic Small Outline (EIAJ SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
Options
-2.7 Low Voltage (2.7V to 5.5V)
-1.8 Low Voltage (1.8V to 5.5V)
15
AT24C32A/64A
3054N–SEEPR–2/04
Package Drawings
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2

AT24C32AY1-10YI-2.7

Mfr. #:
Manufacturer:
Description:
IC EEPROM 32K I2C 400KHZ 8MAP
Lifecycle:
New from this manufacturer.
Delivery:
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