NB7NPQ7021M
www.onsemi.com
9
PACKAGE DIMENSIONS
UQFN16 3x3, 0.5P
CASE 523AF
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
L
D2
E2
C
C0.10
C0.05
C0.05
A1
SEATING
PLANE
e
16X
NOTE 3
b
16X
0.10 C
0.05 C
A
BB
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
b 0.20 0.30
D 3.00 BSC
D2 1.60 1.80
E 3.00 BSC
E2 1.60 1.80
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
5
9
1
13
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2X
0.50
PITCH
1.55
3.30
1
K
DIMENSIONS: MILLIMETERS
0.29
16X
NOTE 4
e/2
2X
0.60
16X
DETAIL A
A3 0.127 REF
17X
A3
A
DETAIL B
DETAIL B
OPTIONAL CONSTRUCTION
L
4X SCALE
DETAIL A
OPTIONAL CONSTRUCTION
2X SCALE
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