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74LV574DB,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
74LV574_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 14 May 2009 13 of 17
NXP Semiconductors
74LV574
Octal D-type flip-flop; positive edge-trigger; 3-state
Fig 13. Package outline SOT339-1 (SSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150
99-12-27
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
74LV574_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 14 May 2009 14 of 17
NXP Semiconductors
74LV574
Octal D-type flip-flop; positive edge-trigger; 3-state
Fig 14. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
74LV574_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 14 May 2009 15 of 17
NXP Semiconductors
74LV574
Octal D-type flip-flop; positive edge-trigger; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74LV574_4 20090514 Product data sheet - 74LV574_3
Modifications:
• Typo removed from Figure 8 and Table 8 adapted accordingly
74LV574_3 20090416 Product data sheet - 74LV574_2
74LV574_2 19970203 Product specification - 74LV574_1
74LV574_1 19980610 Product specification - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

74LV574DB,118

Mfr. #:
Buy 74LV574DB,118
Manufacturer:
NXP Semiconductors
Description:
Flip Flops 3.3V D-TYPE F/F POS
Lifecycle:
New from this manufacturer.
Delivery:
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