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MAX1741EUB+T

P1-P3P4-P6P7-P9P10-P12
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
General Description
The MAX1740/MAX1741 subscriber identity module
(SIM)/smart card level translators provide level shifting
and electrostatic discharge (ESD) protection for SIM and
smart card ports. These devices integrate two unidirec-
tional level shifters for the reset and clock signals, a bidi-
rectional level shifter for the serial data stream, and
±10kV ESD protection on all card contacts.
The MAX1740 includes a SHDN control input to aid
insertion and removal of SIM and smart cards, while the
MAX1741 includes a system-side data driver to support
system controllers without open-drain outputs. The logic
supply voltage range is +1.425V to +5.5V for the “con-
troller side” and +2.25V to +5.5V for the “card side.”
Total supply current is 2.5µA max. Both devices automat-
ically shut down when either power supply is removed.
For a complete SIM-card interface, combine the
MAX1740/MAX1741 with the MAX1686H 0V/3V/5V regu-
lated charge pump.
The MAX1740/MAX1741 are available in ultra-small 10-
pin µMAX packages that are only 1.09mm high and half
the area of an 8-pin SO.
The MAX1740/MAX1741 are compliant with GSM test
specifications 11.11 and 11.12.
Applications
SIM Interface in GSM Cellular Telephones
Smart Card Readers
Logic Level Translation
SPI™/QSPI™/MICROWIRE™ Level Translation
Features
♦ SIM/Smart Card Level Shifting
♦ ±10kV ESD Card Socket Protection
♦ Allows Level Translation with DV
CC
≥ V
CC
or
DV
CC
≤ V
CC
♦ Automatically Shuts Down When Either Supply Is
Removed
♦ Card Contacts Actively Pulled Low During
Shutdown
♦ +1.425V to +5.5V Controller Voltage Range
♦ +2.25V to +5.5V Card Voltage Range
♦ 2.5µA (max) Total Quiescent Supply Current
♦ 0.01µA Total Shutdown Supply Current
♦ Ultra-Small 10-Pin µMAX Package
♦ Compliant with GSM Test Specifications 11.11
and 11.12
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
________________________________________________________________ Maxim Integrated Products 1
IO1DATA
2
3
4
5
9
8
7
6
V
CC
CLK
RST
GNDSHDN (DDRV)
( ) ARE FOR MAX1741.
RIN
CIN
DV
CC
10
MAX1740
MAX1741
µMAX
TOP VIEW
V
CC
SIM OR
SMART
CARD
SYSTEM
CONTROLLER
CLK
IO
GND GND
IO
CLK
GND
V
CC
DV
CC
DV
CC
MAX1740
MAX1741
SHDN*
OPTIONAL
RIN
CIN
RSTRST
OPTIONAL
DATA
DDRV*
SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
*
DV
CC
V
CC
Typical Operating Circuit
19-1458; Rev 0; 1/00
PART
MAX1740EUB
MAX1741EUB
-40°C to +85°C
-40°C to +85°C
TEMP. RANGE PIN-PACKAGE
10 µMAX
10 µMAX
Pin Configuration
Ordering Information
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(Figure 1, DV
CC
= +1.8V, V
CC
= +3.0V or +5.0V, SHDN = DV
CC
, CIN = RIN = GND or DV
CC
, IO = V
CC
, DATA = DDRV = DV
CC
,
C
IO
= C
CLK
= C
RST
= C
DATA
= 30pF, T
A
= 0°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DV
CC
, V
CC
to GND................................................-0.3V to +6.0V
RIN, CIN, DATA, DDRV,
SHDN to GND ......................................-0.3V to (DV
CC
+ 0.3V)
RST, CLK, IO to GND ................................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW
Operating Temperature Range ..........................-40°C to +85°C
Storage Temperature Range ............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) ................................+300°C
UNITS
DV
CC
Operating Range DV
CC
1.425 5.5
V
V
CC
Operating Range V
CC
2.25 5.5
V
DV
CC
Operating Current I
DVCC
CIN static
1
µA
CIN clocked at 1.625MHz from GND to DV
CC
with 50% duty cycle
CONDITIONS
8
CIN clocked at 3.25MHz from GND to DV
CC
with 50% duty cycle
16
V
CC
Operating Current I
VCC
CIN static
1.5
mA
CIN clocked at 1.625MHz from GND to DV
CC
with 50% duty cycle
0.5
CIN clocked at 3.25MHz from GND to DV
CC
with 50% duty cycle
1
Total Shutdown Current I
SHDN
I
OFF
= I
VCC
+ I
DVCC
, SHDN = GND
(MAX1740 only), or DV
CC
= GND
or V
CC
= GND
0.01 2
µA
Digital Input Low Threshold V
IL
0.2 · DV
CC
V
Digital Input High Threshold V
IH
0.7 · DV
CC
V
Input Leakage Current
0.01 1
µA
Digital Output Low Level V
OL
I
SINK
= 200µA
0.4
V
Digital Output High Level V
OH
I
SOURCE
= 20µA
0.9 · V
CC
V
I
SOURCE
= 200µA
0.8 · V
CC
DATA Pull-Up Resistance R
DATA
Between DATA and DV
CC
13 20 28
kΩ
Input Low Threshold V
IL(DATA)
(Note 1)
0.3
V
Input High Threshold V
IH(DATA)
(Note 2)
DV
CC
- 0.6
V
Input Low Current I
IL
V
CC
= 5.0V
1
mA
MIN TYP MAXSYMBOLPARAMETER
Input High Current I
IH
2
µA
POWER SUPPLIES
CIN, RIN, SHDN, DDRV LOGIC INPUTS
CLK, RST OUTPUTS
DATA INPUT/OUTPUT
µA
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(Figure 1, DV
CC
= +1.8V, V
CC
= +3.0V or +5.0V, SHDN = DV
CC
, CIN = RIN = GND or DV
CC
, IO = V
CC
, DATA = DDRV = DV
CC
,
C
IO
= C
CLK
= C
RST
= C
DATA
= 30pF, T
A
= 0°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
UNITS
DV
CC
= 2.7V
DV
CC
= 2.25V
CONDITIONS
DV
CC
= 1.7V
DV
CC
= 1.425V
DV
CC
= 2.25V
DV
CC
= 1.7V
DV
CC
= 1.425V
MIN TYP MAXSYMBOLPARAMETER
Output Low Level V
OL(DATA)
IO = GND, I
SINK
= 100µA
0.4
V
DV
CC
= 3.0V, IO = GND, I
SINK
= 200µA
0.4
V
Output High Level
I
SOURCE
= 10µA
0.7 · DV
CC
V
DV
CC
= 3.0V, I
SOURCE
= 20µA
0.7 · DV
CC
V
V
OH(DATA)
IO Pull-Up Resistance R
IO
Between IO and V
CC
6.5 10 14
kΩ
Input Low Threshold V
IL(IO)
I
IL(MAX)
= 1mA (Note 1)
0.3
V
Input High Threshold V
IH(IO)
I
IH(MAX)
= ±20µA (Note 2)
0.7 · V
CC
V
Input Low Current I
IL
1
mA
Input High Current I
IH
20
µA
Output Low Level V
OL(IO)
DATA = GND or DDRV = GND,
I
SINK
= 200µA
0.4
V
Output High Level V
OH(IO)
I
SOURCE
= 20µA
0.8 · V
CC
V
Shutdown Output Levels
(IO, CLK, RST)
I
SINK
= 200µA, SHDN = GND, DATA = CIN =
RIN = DV
CC
(MAX1740 only)
0.4
V
I
SINK
= 200µA, DV
CC
= GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DV
CC
0.4
V
I
SINK
= 200µA, V
CC
= GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DV
CC
0.4
V
Maximum CLK Frequency
(Notes 3, 4)
f
CLK
V
CC
= 2.7V to 5.5V
5
MHz
5
5
3.5
V
CC
= 2.25V to 3.6V
4
4
3.5
IO INPUT/OUTPUT
SHUTDOWN OUTPUT LEVELS
TIMING
P1-P3P4-P6P7-P9P10-P12

MAX1741EUB+T

Mfr. #:
Buy MAX1741EUB+T
Manufacturer:
Maxim Integrated
Description:
Translation - Voltage Levels SIM/Smart Card Level Translato
Lifecycle:
New from this manufacturer.
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