MAX1741EUB+T

MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
_______________________________________________________________________________________ 7
NAME
2 2 DV
CC
3 3 CIN
4 4 RIN
5 DDRV
8 8 CLK
7 7 RST
6 6 GND
5
SHDN
10 10 IO
9 9 V
CC
Pin Description
Card-Side Bidirectional Input/Output. An open-drain output with a 10k pull-up resistor to
V
CC
. For bidirectional data transfer, connect to an open-drain card output capable of sink-
ing 1mA while pulling IO low. Actively pulled low during shutdown.
Supply Voltage for Card-Side Digital Pins. Set at +2.25V to +5.5V. Proper supply bypass-
ing is required to meet ±10kV ESD specifications.
Clock Output to Card. Actively pulled low during shutdown.
Reset Output to Card. Actively pulled low during shutdown.
System Controller and Card Ground
Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than
2µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate
between DATA and IO is disabled. When not used, connect SHDN to DV
CC
.
Optional System Controller Data Input. Connect to controllers without an open-drain out-
put. When not used, connect DDRV to DV
CC
.
System Controller Reset Input
System Controller Clock Input
Supply Voltage for System Controller Digital Pins. Set at +1.425V to +5.5V.
FUNCTION
1 DATA1
System Controller Data Input/Output. An open-drain input/output with a 20k pull-up
resistor to DV
CC
. For bidirectional data transfer, connect to an open-drain controller output
capable of sinking 1mA while pulling DATA low. If the controller is not open drain, use
DDRV to send data and DATA to receive data.
MAX1740 MAX1741
PIN
Detailed Description
The MAX1740/MAX1741 provide the necessary level
translation for interfacing with subscriber identity mod-
ules (SIMs) and smart cards in multivoltage systems.
These devices operate with logic supply voltages
between +1.425V and +5.5V on the controller side
(DV
CC
) and between +2.25V and +5.5V on the card side
(V
CC
). The total supply current (I
DV
CC
+ I
V
CC
) is 2.5µA
(max) while operating in an idle state (see Electrical
Characteristics). Figure 2 shows a typical application cir-
cuit and functional diagram.
Level Translation
The MAX1740/MAX1741 provide level translators for a
clock input, a reset input, and a bidirectional data
input/output. The clock and reset inputs (CIN and RIN)
are level shifted from the controller-side supply rails
(DV
CC
to GND) to the card-side supply rails (V
CC
to
GND). When connected to an open-drain controller out-
put, DATA and IO provide bidirectional level translation.
GND
IO
CLK
RST
V
CC
DV
CC
+1.8V
+3.0V OR
+5.0V
30pF
30pF
30pF 30pF
MAX1740
MAX1741
SHDN*
RIN
CIN
DDRV*
DATA
SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
*
NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF
TEST PROBES AND BOARD LAYOUT.
Figure 1. MAX1740/MAX1741 Test Circuit
MAX1740/MAX1741
All level translation is valid for DV
CC
V
CC
or DV
CC
V
CC
. The MAX1740/MAX1741 contain internal pull-up
resistors from DATA to the controller-side supply
(DV
CC
) and from IO to the card-side supply (V
CC
). For
push-pull controller outputs, see the Data Driver section
for bidirectional data translation.
Data Driver (MAX1741 only)
When using a microcontroller (µC) without an open-drain
output, use the data driver (DDRV) input to send data to
the SIM/smart card, while DATA provides the controller-
side output for bidirectional data transfer. When not
used, connect DDRV to DV
CC
to reduce total supply cur-
rent.
Shutdown Mode
For the MAX1740, drive SHDN low to activate shut-
down. Connect SHDN to DV
CC
or drive high for normal
operation. To allow for card insertion and removal, shut-
down mode actively pulls CLK, RST, and IO low; it also
disconnects the internal 10k pull-up resistor from V
CC
to prevent excessive current draw. Shutdown mode
reduces the total supply current (I
DVCC
+ I
VCC
) to
0.01µA.
SIM/Smart Card Insertion/Removal
The SIM/smart card specifications require that the
card-side pins (V
CC
, CLK, RST, IO) be at ground
potential prior to inserting the SIM/smart card. For
applications using the MAX1686H (Figure 4), the easi-
est way to achieve this is by shutting down the
MAX1686H or by driving SHDN (MAX1740 only) low. If
specific sequencing is desired, pull IO low by driving
either DATA or DDRV (MAX1741 only) low, and pull
CLK and RST low by driving CIN and RIN low, respec-
tively.
ESD Protection
As with all Maxim devices, ESD-protection structures
on all pins protect against electrostatic discharges
(ESDs) encountered during handling and assembly.
For further protection during card insertion and
removal, the pins that connect to the card socket (CLK,
RST, IO, V
CC
, and GND) provide protection against
±10kV of ESD, according to the Human Body Model.
The ESD structures withstand high ESD in all states:
normal operation, shutdown, and power-down. After an
ESD event, the MAX1740/MAX1741 continue working
without latchup.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, test methodology, and test results.
Human Body Model
Figure 3a shows the Human Body Model, and Figure
3b shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
SIM/Smart Card Level Translators
in µMAX
8 _______________________________________________________________________________________
Figure 2. Typical Application Circuit and Functional Diagram
V
CC
SIM OR
SMART CARD
SYSTEM
CONTROLLER
CLK
RST
1µF
GND
GND
CLK
RST
GND
V
CC
DV
CC
DV
CC
MAX1740
MAX1741
SHDN*
OPTIONAL
RIN
CIN
20k 10k
OPTIONAL
DATA
DDRV*
SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
*
SHUTDOWN
CONTROL
IO
IO
1µF
DV
CC
V
CC
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
_______________________________________________________________________________________ 9
est, which is then discharged into the test device
through a 1.5k resistor.
Applications Information
SIM/Smart Card Interface
To provide 5V when interfacing with a 5V SIM/smart
card, 3V systems require a DC-DC converter. The
MAX1686H +5V regulating charge pump for SIM cards
provides 0V/3V/5V for full compatibility with SIM/smart
card specifications. Figure 4 shows the charge pump
for SIM card applications. Alternatively, the MAX619
generates a regulated 5V from input voltages as low as
2V.
SPI/QSPI/MICROWIRE Interface
The MAX1740/MAX1741 are also useful as 3V/5V level
shifters in SPI, QSPI, and MICROWIRE applications
(Figure 5). On the slave side, connect CLK to SCLK,
RST to CS, and IO to DOUT and DIN. The unidirectional
level shifters transfer chip select and clock signals to
the slave device(s), while the bidirectional level shifter
transfers data.
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
C
s
100pF
R
C
1M
R
D
1500
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 3a. Human Body ESD Test Model
I
P
100%
90%
36.8%
t
RL
TIME
t
DL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
r
10%
0
0
AMPERES
Figure 3b. Human Body Model Current Waveform
V
CC
SIM OR
SMART
CARD
SYSTEM
CONTROLLER
CLK
RST
IO
GND GND
IO
CLK
RST
OUT
GND
PGND
GND
V
CC
DV
CC
DV
CC
+3.0V
3.0V OR 5.0V
MAX1740
MAX1741
MAX1686
MAX1686H
SHDN*
SHDN
3/5
OPTIONAL
RIN
IN
CXN CXP
CIN
OPTIONAL
DATA
DDRV*
SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
*
Figure 4. Using MAX1740/MAX1741 and MAX1686/MAX1686H
Charge Pump for SIM Card Applications
V
CC
SPI/QSPI/
MICROWIRE
SYSTEM
SYSTEM
CONTROLLER
SCLK
CS
DOUT
DIN
GND GND
IO
CLK
RST
OUT
SET
PGND
GND
V
CC
DV
CC
DV
CC
+5.0V
+3.3V
MAX1740
MAX1741
MAX8867
MAX8860
SHDN*
SHDN
OPTIONAL
RIN
IN
CIN
OPTIONAL
DATA
DDRV*
SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
*
Figure 5. MAX1740/MAX1741 with SPI/QSPI/MICROWIRE
Interfaces
TRANSISTOR COUNT: 114
___________________Chip Information

MAX1741EUB+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Translation - Voltage Levels SIM/Smart Card Level Translato
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet