General Description
The DS28E38 is an ECDSA public key-based secure
authenticator that incorporates Maxim’s patented
ChipDNA™ PUF technology. ChipDNA technology
involves a physically unclonable function (PUF) that
enables the DS28E38 to deliver cost-effective protec-
tion against invasive physical attacks. Using the random
variation of semiconductor device characteristics that
naturally occur during wafer fabrication, the ChipDNA
circuit generates a unique output value that is repeatable
over time, temperature, and operating voltage. Attempts
to probe or observe ChipDNA operation modifies the
underlying circuit characteristics, preventing discovery
of the unique value used by the chip cryptographic func-
tions. The DS28E38 utilizes the ChipDNA output as key
content to cryptographically secure all device stored data
and optionally, under user control, as the private key for
the ECDSA signing operation. With ChipDNA capabil-
ity, the device provides a core set of cryptographic tools
derived from integrated blocks including an asymmetric
(ECC-P256) hardware engine, a FIPS/NIST-compliant
true random number generator (TRNG), 2Kb of secured
EEPROM, a decrement-only counter and a unique 64-bit
ROM identification number (ROM ID). The ECC public/
private key capabilities operate from the NIST-defined
P-256 curve to provide a FIPS 186-compliant ECDSA
signature generation function. The unique ROM ID is
used as a fundamental input parameter for cryptographic
operations and serves as an electronic serial number
within the application. The DS28E38 communicates over
the single-contact 1-Wire® bus at both standard and
overdrive speeds. The communication follows the 1-Wire
protocol with the ROM ID acting as node address in the
case of a multidevice 1-Wire network.
Applications
Authentication of Medical Sensors and Tools
Secure Management of Limited Use Consumables
IoT Node Authentication
Peripheral Authentication
Reference Design License Management
Printer Cartridge Identification and Authentication
Ordering Information appears at end of data sheet.
19-100093; Rev 1; 9/17
Benets and Features
Robust Countermeasures Protect Against Security
Attacks
Patented Physically Unclonable Function Secures
Device Data
Actively Monitored Die Shield Detects and Reacts
to Intrusion Attempts
All Stored Data Cryptographically Protected from
Discovery
Efficient Public-Key Authentication Solution to
Authenticate Peripherals
FIPS 186-Compliant ECDSA P256 Signature for
Challenge/Response Authentication
Options for ECDSA Public/Private Key Pair Source
Include ChipDNA Generated, Chip Computed, and
User Installed
TRNG with NIST SP 800-90B Compliant Entropy
Source
Supplemental Features Enable Easy Integration into
End Applications
17-Bit One-Time Settable, Nonvolatile Decrement-
Only Counter with Authenticated Read
2Kbits of EEPROM for User Data, Key, Control
Registers, and Certicate
Unique and Unalterable Factory Programmed
64-Bit Identication Number (ROM ID)
Single-Contact, 1-Wire Interface Communication
with Host at 11.7kbps and 62.5kbps
Operating Range: 3.3V ±10%, -40°C to +85°C
6-Pin TDFN-EP Package (3mm x 3mm)
DeepCover and 1-Wire are registered trademarks and
ChipDNA is a trademark of Maxim Integrated Products, Inc.
Request Security User Guide and Developer Software ›
DS28E38 DeepCover® Secure ECDSA Authenticator
with ChipDNA PUF Protection
EVALUATION KIT AVAILABLE
Typical Application Circuit
µC
PIOX
PIOY
100kΩ
DS28E38
R
PUP
V
CC
Q1
IO
*NOTE: USE A Q1 LOW-IMPEDANCE BYPASS OR EQUALLY DRIVE LOGIC ‘1’ WITH PIOY.
BIDIRECTIONAL
GND
V
CC
GND
OPEN DRAIN PORT
1kΩ
*PMV65XP
C
EXT
C
X
V
CC
I
2
C
PORT
SDA
SCL
V
CC
PIOA
PIOB
IO
IO
Rp
DS2476
www.maximintegrated.com
Maxim Integrated
2
DS28E38 DeepCover® Secure ECDSA Authenticator
with ChipDNA PUF Protection
Voltage Range on Any Pin Relative to GND ..........-0.5V to 4.0V
Maximum Current into Any Pin........................... -20mA to 20mA
Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -40°C to +125°C
Lead temperature (soldering, 10s) ..................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
6 TDFN-EP
PACKAGE CODE T633+2
Outline Number 21-0137
Land Pattern Number 90-0058
Thermal Resistance, Single-Layer Board:
Junction to Ambient (θ
JA
) 55ºC/W
Junction to Case (θ
JC
) 9ºC/W
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
) 42ºC/W
Junction to Case (θ
JC
) 9ºC/W
(Limits are 100% tested at T
A
= +25°C and T
A
= +85°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested.
Specifications to the minimum operating temperature are guaranteed by design and are not production tested. )
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IO PIN: GENERAL DATA
1-Wire Pullup Voltage V
PUP
System requirement 2.97 3.3 3.63 V
1-Wire Pullup Resistance R
PUP
(Note 1) 1000 Ω
Input Capacitance C
IO
(Notes 1, 2)
0.1 +
C
X
nF
Capacitor External C
X
System requirement. IO pin at V
PUP
399.5 470 540.5 nF
Input Load Current I
L
IO pin at V
PUP
10 360 µA
High-to-Low Switching
Threshold
V
TL
(Notes 3, 4)
0.65 x
V
PUP
V
Input Low Voltage V
IL
(Note 5)
0.10 x
V
PUP
V
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
Electrical Characteristics
www.maximintegrated.com
Maxim Integrated
3
DS28E38 DeepCover® Secure ECDSA Authenticator
with ChipDNA PUF Protection

DS28E38Q+U

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Security ICs / Authentication ICs PUF ECDSA SECURE AUTHENTICATOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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