(Limits are 100% tested at T
A
= +25°C and T
A
= +85°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested.
Specifications to the minimum operating temperature are guaranteed by design and are not production tested. )
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Low-to-High Switching
Threshold
V
TH
(Notes 3, 6)
0.75 x
V
PUP
V
Switching Hysteresis V
HY
(Notes 3, 7) 0.3 V
Output Low Voltage V
OL
I
OL
= 4mA (Note 8) 0.4 V
IO PIN: 1-Wire INTERFACE
Recovery Time (Note 9) t
REC
Standard speed, R
PUP
= 1000Ω 25
μsOverdrive speed, R
PUP
= 1000Ω 10
Directly prior to reset pulse: R
PUP
= 1000Ω 100
Rising-Edge Hold-O
(Note 10)
t
REH
Applies to standard speed only 1 μs
Time Slot Duration
(Note 11)
t
SLOT
Standard speed 85
μs
Overdrive speed 16
IO PIN: 1-Wire RESET, PRESENCE-DETECT CYCLE
Reset Low Time t
RSTL
System requirement, standard speed 480 640
μs
System requirement, overdrive speed 48 80
Reset High Time
(Note 21)
t
RSTH
Standard speed 480
μs
Overdrive speed 48
Presence-Detect Sample
Time (Note 12)
t
MSP
Standard speed 60 75
μs
Overdrive speed 6 10
IO PIN: 1-Wire WRITE
Write-Zero Low Time
(Note 13)
t
W0L
Standard speed 60 120
μs
Overdrive speed 6 15.5
Write-One Low Time
(Note 13)
t
W1L
Standard speed 0.25 15
μs
Overdrive speed 0.25 2
IO PIN: 1-Wire READ
Read Low Time (Note 14) t
RL
Standard speed 0.25 15 - δ
μs
Overdrive speed 0.25 2 - δ
Read Sample Time
(Note 14)
t
MSR
Standard speed t
RL
+ δ 15
μs
Overdrive speed t
RL
+ δ 2
STRONG PULLUP OPERATION
Strong Pullup Current I
SPU
(Note 15) 10 mA
Strong Pullup Voltage V
SPU
(Note 15) 2.8 V
Read Memory t
RM
30 ms
Write Memory t
WM
65 ms
Write State t
WS
15 ms
Generate ECC Key Pair t
GKP
200 ms
Electrical Characteristics (continued)
www.maximintegrated.com
Maxim Integrated
4
DS28E38 DeepCover® Secure ECDSA Authenticator
with ChipDNA PUF Protection
(Limits are 100% tested at T
A
= +25°C and T
A
= +85°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested.
Specifications to the minimum operating temperature are guaranteed by design and are not production tested. )
Note 1: System requirement. Maximum allowable pullup resistance is a function of the number of 1-Wire devices in the system
and 1-Wire recovery times. The specified value here applies to systems with only one device and with the minimum 1-Wire
recovery times.
Note 2: Value represents the typical parasite capacitance when V
PUP
is first applied. Once the parasite capacitance is charged,
it does not affect normal communication. Typically, during normal communication, the parasite capacitance is effectively
~100pF.
Note 3: V
TL
, V
TH
, and V
HY
are a function of the internal supply voltage, which is a function of V
PUP
, R
PUP
, 1-Wire timing, and
capacitive loading on IO. Lower V
PUP
, higher R
PUP
, shorter t
REC
, and heavier capacitive loading all lead to lower values of
V
TL
, V
TH
, and V
HY
.
Note 4: Voltage below which, during a falling edge on IO, a logic-zero is detected.
Note 5: The voltage on IO must be less than or equal to V
ILMAX
at all times the master is driving IO to a logic-zero level.
Note 6: Voltage above which, during a rising edge on IO, a logic-one is detected.
Note 7: After V
TH
is crossed during a rising edge on IO, the voltage on IO must drop by at least V
HY
to be detected as logic-zero.
Note 8: The I-V characteristic is linear for voltages less than 1V.
Note 9: System requirement. Applies to a single device attached to a 1-Wire line.
Note 10: The earliest recognition of a negative edge is possible at t
REH
after V
TH
has been previously reached.
Note 11: Defines maximum possible bit rate. Equal to 1/(t
W0LMIN
+ t
RECMIN
).
Note 12: System requirement. Interval after t
RSTL
during which a bus master can read a logic 0 on IO if there is a DS28E38 present.
The power-up presence detect pulse could be outside this interval but will be complete within 2ms after power-up.
Note 13: System requirement. ε in Figure 5 represents the time required for the pullup circuitry to pull the voltage on IO up from V
IL
to
V
TH
. The actual maximum duration for the master to pull the line low is t
W1LMAX
+ t
F
- ε and t
W0LMAX
+ t
F
- ε, respectively.
Note 14: System requirement. δ in Figure 5 represents the time required for the pullup circuitry to pull the voltage on IO up from V
IL
to
the input-high threshold of the bus master. The actual maximum duration for the master to pull the line low is t
RLMAX
+ t
F
.
Note 15: Current drawn from IO during a SPU operation interval. The pullup circuit on IO during the SPU operation interval should
be such that the voltage at IO is greater than or equal to V
SPUMIN
. A low-impedance bypass of R
PUP
activated during the
SPU operation is the recommended way to meet this requirement.
Note 16: Write-cycle endurance is tested in compliance with JESD47G.
Note 17: Not 100% production tested; guaranteed by reliability monitor sampling.
Note 18: Data retention is tested in compliance with JESD47G.
Note 19: Guaranteed by 100% production test at elevated temperature for a shorter time; equivalence of this production test to the
data sheet limit at operating temperature range is established by reliability testing.
Note 20: EEPROM writes can become nonfunctional after the data-retention time is exceeded. Long-term storage at elevated
temperatures is not recommended.
Note 21: An additional reset or communication sequence cannot begin until the reset high time has expired.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Generate ECDSA
Signature
t
GES
130 ms
TRNG On-Demand
Check
t
ODC
20 ms
EEPROM
Write/Erase Cycles
(Endurance)
N
CY
(Notes 16, 17) 100K
Data Retention t
DR
T
A
= +85ºC (Notes 18, 19, 20) 10 years
Electrical Characteristics (continued)
www.maximintegrated.com
Maxim Integrated
5
DS28E38 DeepCover® Secure ECDSA Authenticator
with ChipDNA PUF Protection
DS28E38Q+
PIN NAME FUNCTION
1, 4, 5 N.C. No Connection
2 IO 1-Wire IO
3 Ground Ground
6 CEXT Input for External Capacitor
EP
Exposed Pad (TDFN Only). Solder evenly to the board's ground plane for proper operation. Refer to
Application Note 3273: Exposed Pads: A Brief Introduction for additional information.
Pin Description
Pin Conguration
N.C. 1
IO 2
GND 3
6 CEXT
5 N.C.
4 N.C.
+
TDFN-EP
(3mm x 3mm)
TOP VIEW
DS28E38
www.maximintegrated.com
Maxim Integrated
6
DS28E38 DeepCover® Secure ECDSA Authenticator
with ChipDNA PUF Protection

DS28E38Q+U

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Security ICs / Authentication ICs PUF ECDSA SECURE AUTHENTICATOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet