Document Number: 002-13915 Rev. *C Page 4 of 21
S70GL02GT
1. Ordering Information
1.1 Recommended Combinations
The following table lists various configurations planned to be available in volume. This table will be updated when new combinations
are released. Check with your local sales representative to confirm availability of specific configurations not listed here or to check
on newly released combinations.
Valid Combinations Standard Grade
Notes
1. BGA package marking omits leading “S70” and packing type designator from ordering part number.
2. Packing Type “0” is standard option.
Valid Combinations — Automotive Grade / AEC-Q100
The following table lists configurations that are Automotive Grade/AEC-Q100 qualified and are planned to be available in volume.
This table will be updated when new combinations are released. Consult your local sales representative to confirm availability of
specific combinations and to check on newly released combinations.
Production Part Approval Process (PPAP) support is only provided for AEC-Q100 grade products.
Products to be used in end-use applications that require ISO/TS-16949 compliance must be AEC-Q100 grade products in
combination with PPAP. Non–AEC-Q100 grade products are not manufactured or documented in full compliance with
ISO/TS-16949 requirements. AEC-Q100 grade products are also offered without PPAP support for end-use applications that do not
require ISO/TS-16949 compliance.
Notes
1. BGA package marking omits leading “S70” and packing type designator from ordering part number.
2. Packing Type “0” is standard option.
Table 1. S29GL-T Valid Combinations
Base OPN Speed (ns)
Package and
Temperature
Model Number Packing Type
Ordering Part Number
(x = Packing Type)
S70GL02GT
110
FHI, FHV
(Note 1)
01
0, 3
(Note 2)
S70GL02GT11FHI01x
S70GL02GT11FHV01x
02
S70GL02GT11FHI02x
S70GL02GT11FHV02x
120
V1
S70GL02GT12FHIV1x
S70GL02GT12FHVV1x
V2
S70GL02GT12FHIV2x
S70GL02GT12FHVV2x
Table 2. S29GL-T Valid Combinations
Base OPN Speed (ns)
Package and
Temperature
Model Number Packing Type
Ordering Part Number
(x = Packing Type)
S70GL02GT
110
FHA, FHB
(Note 1)
01
0, 3
(Note 2)
S70GL02GT11FHA01x
S70GL02GT11FHB01x
02
S70GL02GT11FHA02x
S70GL02GT11FHB02x
120
V1
S70GL02GT12FHAV1x
S70GL02GT12FHBV1x
V2
S70GL02GT12FHAV2x
S70GL02GT12FHBV2x
Document Number: 002-13915 Rev. *C Page 5 of 21
S70GL02GT
The ordering part number is formed by a valid combination of the following:
S70GL02GT 12 F H I 01 0
PACKING TYPE
0 = Tray (standard)
3 = 13” Tape and Reel
MODEL NUMBER (V
IO
range, protection when WP# = V
IL
)
01 = V
IO
= V
CC
= 2.7 V to 3.6 V, highest address sector protected
V1 = V
IO
= 1.65 V to V
CC
, V
CC
= 2.7 V to 3.6 V, highest address sector protected
02 = V
IO
= V
CC
= 2.7 V to 3.6 V, lowest address sector protected
V2 = V
IO
= 1.65 V to V
CC
, V
CC
= 2.7 V to 3.6 V, lowest address sector protected
TEMPERATURE RANGE / GRADE
I = Industrial (–40 °C to +85 °C)
V = Industrial Plus (–40 °C to +105 °C)
A = Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)
B = Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)
PACKAGE MATERIALS SET
H = Low Halogen, Pb-free
PACKAGE TYPE
F = Fortified Ball Grid Array, 1.0 mm pitch package (LSH064), 11 mm x 13 mm
SPEED OPTION
11 = 110 ns
12 = 120 ns
DEVICE NUMBER / DESCRIPTION
S70GL02GT
3.0 V-only, 2048 Megabit (128M x 16-Bit/256M x 8-Bit) Page-Mode Flash Memory
Manufactured on 45-nm MirrorBit Eclipse process technology
Document Number: 002-13915 Rev. *C Page 6 of 21
S70GL02GT
2. Input/Output Descriptions and Logic Symbol
Table 3 identifies the input and output package connections provided on the device.
Table 3. Input/Output Descriptions
Symbol Type Description
DQ14–DQ0 I/O Data inputs and outputs.
DQ15/A-1 Input/Output
DQ15: Data inputs and outputs.
A-1: LSB address input in byte mode.
CE# Input Chip Enable. At V
IL
, selects the device for data transfer with the host memory controller.
OE# Input
Output Enable. At V
IL
, causes outputs to be actively driven. At V
IH
, causes outputs to be high
impedance (High-Z).
WE# Input
Write Enable. At V
IL
, indicates data transfer from the host to device. At V
IH
, indicates data
transfer is from the device to host.
A26-A0 Input Address lines for S29GL02GT.
V
CC
Supply Core power supply.
V
IO
Supply Versatile I/O power supply.
V
SS
Supply Power supplies ground.
RY/BY#
Output — open
drain
Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At V
IL
, the
device is actively engaged in an embedded algorithm such as erasing or programming. At
High-Z, the device is ready for read or a new command write — requires an external pull-up
resistor to detect the High-Z state. Multiple devices may have their
RY/BY# outputs tied together to detect when all devices are ready.
BYTE# Input
Selects data bus width. At V
IL
, the device is in byte configuration and data I/O pins DQ7-DQ0
are active and DQ15/A-1 becomes the LSB address input. At V
IH
, the device is in word
configuration and data I/O pins DQ15-DQ0 are active.
RESET# Input
Hardware Reset. At V
IL
, causes the device to reset control logic to its standby state, ready for
reading array data.
WP# Input
Write Protect. At V
IL
, disables program and erase functions in the highest address 64-kword
(128-KB) sector of the device. At V
IH
, the sector is not protected. WP# has an internal pull-up;
When unconnected WP# is at V
IH
.
NC No Connect
Not Connected internally. The pin/ball location may be used in the printed circuit board (PCB)
as part of a routing channel.
DNU Reserved
Do Not Use. Reserved for use by Cypress. The pin/ball is connected internally. The input has
an internal pull-down resistance to V
SS
. The pin/ball can be left open or tied to V
SS
on the PCB.
RFU No Connect
Reserved for Future Use. Not currently connected internally but the pin/ball location should be
left unconnected and unused by the PCB routing channel for future compatibility. The pin/ball
may be used by a signal in the future.

S70GL02GT12FHIV10

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
NOR Flash Nor
Lifecycle:
New from this manufacturer.
Delivery:
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