Figure 3. LSH064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,
DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
"e" REPRESENTS THE SOLDER BALL GRID PITCH.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A
SOLDER BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK
8.
7.
6.
NOTES:
5.
4.
3.
2.
1. ALL DIMENSIONS ARE IN MILLIMETERS.
SD
b
eE
eD
ME
N
0.50
0.50 BSC
1.00 BSC
1.00 BSC
0.60
64
8
0.70
DIMENSIONS
D1
MD
E1
E
D
A
A1
SYMBOL
0.40
MIN.
-
7.00 BSC
7.00 BSC
8
11.00 BSC
13.00 BSC
NOM.
-
1.40
-
MAX.
SE
0.50 BSC
-
METALIZED MARK, INDENTATION OR OTHER MEANS.
"SD" = eD/2 AND "SE" = eE/2.
PLANE PARALLEL TO DATUM C.
"SD" OR "SE" = 0.
SIZE MD X ME.
BALLS.
DETAIL A
