© Semiconductor Components Industries, LLC, 2018
January, 2018 − Rev. 0
1 Publication Order Number:
NCD5703/D
NCD5703A, NCD5703B,
NCD5703C
High Current IGBT Gate
Drivers
The NCD5703A, NCD5703B and NCD5703C are high−current,
high−performance stand−alone IGBT drivers for high power
applications that include solar inverters, motor control and
uninterruptible power supplies. The devices offer a cost−effective
solution by eliminating external output buffer. Devices protection
features include accurate Under−voltage−lockout (UVLO),
desaturation protection (DESAT) and Active open−drain FAULT
output. The drivers also feature an accurate 5.0 V output. The drivers
are designed to accommodate a wide voltage range of bias supplies
including unipolar and NCD5703B even bipolar voltages.
Depending on the pin configuration the devices also include Active
Miller Clamp (NCD5703A) and separate high and low (V
OH
and V
OL
)
driver outputs for system design convenience (NCD5703C).
All three available pin configuration variants have 8−pin SOIC
package.
Features
• High Current Output (+4/−6 A) at IGBT Miller Plateau voltages
• Low Output Impedance for Enhanced IGBT Driving
• Short Propagation Delay with Accurate Matching
• Direct Interface to Digital Isolator/Opto−coupler/Pulse Transformer
for Isolated Drive, Logic Compatibility for Non−isolated Drive
• DESAT Protection with Programmable Delay
• Tight UVLO Thresholds for Bias Flexibility
• Wide Bias Voltage Range
• This Device is Pb−Free, Halogen−Free and RoHS Compliant
NCD5703A Features
• Active Miller Clamp to Prevent Spurious Gate Turn−on
NCD5703B Features
• Negative Output Voltage for Enhanced IGBT Driving
NCD5703C Features
• Separate Outputs for V
OL
and V
OH
Typical Applications
• Solar Inverters
• Motor Control
• Uninterruptible Power Supplies (UPS)
• Rapid Shutdown for Photovoltaic Systems
MARKING
DIAGRAM
www.onsemi.com
SOIC−8
D SUFFIX
CASE 751
See detailed ordering and shipping information on page 9 o
this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
1
8
NCD5703 = Specific Device Code
X = A, B or C
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
NCD5703X
ALYW
G
1
8
NCD5703A
CLAMP
GND
VO
VCC
VIN
VREF
FLT
DESAT
NCD5703B
VEE
GND
VO
VCC
VIN
VREF
FLT
DESAT
NCD5703C
GND
VOL
VOH
VCC
VIN
VREF
FLT
DESAT
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
