CM1235
http://onsemi.com
9
PACKAGE DIMENSIONS
WDFN16, 4x1.7, 0.5P
CASE 511BG−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 4.00 BSC
D2 3.10 3.30
E 1.70 BSC
E2 0.40 0.60
e 0.50 BSC
L 0.25 0.35
0.10 C
D
E
B
A
2X
2X
NOTE 4
A
A1
(A3)
0.10 C
PIN ONE
REFERENCE
0.08 C
0.10 C
C
SEATING
PLANE
D2
E2
BOTTOM VIEW
b
e
16X
0.10 B
0.05
AC
C
L
16X
K
SIDE VIEW
TOP VIEW
NOTE 3
18
916
16X
16X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DETAIL A
L1 −−− 0.15
DIMENSION: MILLIMETERS
RECOMMENDED
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
DETAIL B
e/2
0.53
2.00
0.30
0.60
3.30
0.50
PITCH
K 0.30 REF
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