REV. 0
AD7741/AD7742
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7741/AD7742 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
TIMING CHARACTERISTICS
1, 2, 3
Limit at T
MIN
, T
MAX
Parameter (B and Y Version) Units Conditions/Comments
f
CLKIN
6.144 MHz max
t
HIGH
/t
LOW
55/45 max Input Clock Mark/Space Ratio
45/55 min
t
1
9 ns typ f
CLOCK
Rising Edge to f
OUT
Rising Edge
t
2
4 ns typ f
OUT
Rise Time
t
3
4 ns typ f
OUT
Fall Time
t
4
t
HIGH
± 5 ns typ f
OUT
Pulsewidth
NOTES
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of (V
IL
+ V
IH
)/2.
3
See Figure 1.
Specifications subject to change without notice.
(V
DD
= +4.75 V to +5.25 V; V
REF
= +2.5 V. All specifications T
MIN
to T
MAX
unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= +25°C unless otherwise noted)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7 V
Analog Input Voltage to GND . . . . . . . . –5␣ V to V
DD
+ 0.3 V
Digital Input Voltage to GND . . . . . . . –0.3␣ V to V
DD
+ 0.3 V
Reference Input Voltage to GND . . . . –0.3 V to V
DD
+ 0.3 V
f
OUT
to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Automotive (Y Version) . . . . . . . . . . . . . . –40°C to +105°C
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance (8 Lead) . . . . . . . . . . . . . 125°C/W
θ
JA
Thermal Impedance (16 Lead) . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance (8 Lead) . . . . . . . . . . . . . 157°C/W
θ
JA
Thermal Impedance (16 Lead) . . . . . . . . . . . . 125°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
ORDERING GUIDE
Temperature Package Package
Models Ranges Descriptions Options
AD7741BN –40°C to +85°C Plastic DIP N-8
AD7741BR –40°C to +85°C Small Outline R-8
AD7741YR –40°C to +105°C Small Outline R-8
AD7742BN –40°C to +85°C Plastic DIP N-16
AD7742BR –40°C to +85°C Small Outline R-16A
AD7742YR –40°C to +105°C Small Outline R-16A
CLKIN
f
OUT
t
HIGH
t
4
t
1
t
2
t
3
Figure 1. Timing Diagram