NCP5030
http://onsemi.com
14
PACKAGE DIMENSIONS
WDFN12, 3x4, 0.5P
CASE 506AY−01
ISSUE B
PIN 1
INDEX AREA
A
B
C0.10
C0.10
2X
2X
A
C
C0.08
12X
C0.10
SIDE VIEW
TOP VIEW
E2
D2
BOTTOM VIEW
e
b 12X
L
16
12 7
D
E
A3
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 4.00 BSC
D2 3.20 3.40
E 3.00 BSC
E2 1.60 1.80
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
0.10 B
0.05
AC
C
NOTE 3
12X
K12X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
3.30
12 X
1.75
0.55
12 X
0.30
3.35
0.50 PITCH
DIMENSIONS: MILLIMETERS
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NCP5030/D
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