7
LTC2400
Conversion Current vs Temperature
Sleep Current vs Temperature
PSRR vs Frequency at V
CC
PSRR vs Frequency at V
CC
PSRR vs Frequency at V
CC
Rejection vs Frequency at V
IN
Rejection vs Frequency at V
IN
Rejection vs Frequency at V
IN
TYPICAL PERFOR A CE CHARACTERISTICS
UW
TEMPERATURE (°C)
–55
SUPPLY CURRENT (µA)
220
20
2400 G19
190
170
–30 –5 45
160
150
230
210
200
180
70 95 120
V
CC
= 5.5V
V
CC
= 4.1V
V
CC
= 2.7V
TEMPERATURE (°C)
–55
SUPPLY CURRENT (µA)
20
25
30
20 70
2400 G20
15
10
–30 –5
45 95 120
5
0
V
CC
= 2.7V, 5.5V
FREQUENCY AT V
CC
(Hz)
0
130
REJECTION (dB)
110
–90
–70
–50
–30
–10
50 100 150 200
2400 G21
250
V
CC
= 4.1V
V
IN
= 0V
T
A
= 25°C
F
0
= 0
FREQUENCY AT V
CC
(Hz)
15200
120
REJECTION (dB)
100
–80
–60
–40
0
15250
15300 15350 15400
1635 G22
15450 15500
–20
V
CC
= 4.1V
V
IN
= 0V
T
A
= 25°C
F
O
= 0
FREQUENCY AT V
CC
(Hz)
1
–120
REJECTION (dB)
–100
–80
–60
–40
–20
0
100 10k 1M
2400 G23
V
CC
= 4.1V
V
IN
= 0V
T
A
= 25°C
F
O
= 0
15,360Hz 153,600Hz
FREQUENCY AT V
IN
(Hz)
1
120
REJECTION (dB)
100
–80
–60
–40
–20
0
50 100 150 200
2400 G24
250
V
CC
= 5V
V
REF
= 5V
V
IN
= 2.5V
F
O
= 0
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
128404812
REJECTION (dB)
2400 G25
–60
–70
–80
–90
100
110
120
130
140
FREQUENCY AT V
IN
(Hz)
15100
120
REJECTION (dB)
100
–80
–60
–40
–20
0
15200 15300 15400 15500
2400 G26
V
CC
= 5V
V
REF
= 5V
V
IN
= 2.5V
F
O
= 0
SAMPLE RATE = 15.36kHz ±2%
Rejection vs Frequency at V
IN
INPUT FREQUENCY
0
–60
–40
0
2400 F26
–80
100
f
S
/2 f
S
120
140
–20
REJECTION (dB)
8
LTC2400
INL vs Output Rate Resolution vs Output Rate
TYPICAL PERFOR A CE CHARACTERISTICS
UW
V
CC
(Pin 1): Positive Supply Voltage. Bypass to GND
(Pin␣ 4) with a 10µF tantalum capacitor in parallel with
0.1µF ceramic capacitor as close to the part as possible.
V
REF
(Pin 2): Reference Input. The reference voltage range
is 0.1V to V
CC
.
V
IN
(Pin 3): Analog Input. The input voltage range is
0.125 • V
REF
to 1.125 • V
REF
. For V
REF
> 2.5V, the input
voltage range may be limited by the pin absolute maxi-
mum rating of –0.3V to V
CC
+ 0.3V.
GND (Pin 4): Ground. Shared pin for analog ground,
digital ground, reference ground and signal ground. Should
be connected directly to a ground plane through a mini-
mum length trace or it should be the single-point-ground
in a single point grounding system.
CS (Pin 5): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW on CS wakes up the ADC. A
LOW-to-HIGH transition on this pin disables the SDO
digital output. A LOW-to-HIGH transition on CS during the
Data Output transfer aborts the data transfer and starts a
new conversion.
OUTPUT RATE (Hz)
0
INL (BITS)
12
18
20
60
2400 G27
10
8
15 20 25105 303540455055
24
22
16
14
V
CC
= 5V
V
REF
= 5V
T
A
= 25°C
F
0
= EXTERNAL
OUTPUT RATE (Hz)
0
RESOLUTION (BITS)*
12
18
20
60
2400 G28
10
8
15 20 25105 303540455055
24
22
16
14
V
CC
= 5V
V
REF
= 5V
T
A
= 25°C
F
O
= EXTERNAL
*RESOLUTION =
LOG(V
REF
/RMS NOISE)
LOG (2)
SDO (Pin 6): Three-State Digital Output. During the data
output period, this pin is used for serial data output. When
the chip select CS is HIGH (CS = V
CC
), the SDO pin is in a
high impedance state. During the Conversion and Sleep
periods this pin can be used as a conversion status output.
The conversion status can be observed by pulling CS LOW.
SCK (Pin 7): Bidirectional Digital Clock Pin. In Internal
Serial Clock Operation mode, SCK is used as digital output
for the internal serial interface clock during the data output
period. In External Serial Clock Operation mode, SCK is
used as digital input for the external serial interface. A
weak internal pull-up is automatically activated in Internal
Serial Clock Operation mode. The Serial Clock mode is
determined by the level applied to SCK at power up and the
falling edge of CS.
F
O
(Pin 8): Frequency Control Pin. Digital input that
controls the ADC’s notch frequencies and conversion
time. When the F
O
pin is connected to V
CC
(F
O
= V
CC
), the
converter uses its internal oscillator and the digital filter
first null is located at 50Hz. When the F
O
pin is connected
to GND (F
O
= OV), the converter uses its internal oscillator
and the digital filter first null is located at 60Hz. When F
O
is driven by an external clock signal with a frequency f
EOSC,
the converter uses this signal as its clock and the digital
filter first null is located at a frequency f
EOSC
/2560.
PIN FUNCTIONS
UUU
9
LTC2400
FU CTIO AL BLOCK DIAGRA
UU
W
TEST CIRCUITS
Figure 1. LTC2400 State Transition Diagram
APPLICATIONS INFORMATION
WUU
U
AUTOCALIBRATION
AND CONTROL
DAC
DECIMATING FIR
INTERNAL
OSCILLATOR
SERIAL
INTERFACE
ADC
GND
V
CC
V
IN
SDO
SCK
V
REF
CS
F
O
(INT/EXT)
2400 FD
3.4k
SDO
2400 TA03
HI-Z TO V
OH
V
OL
TO V
OH
V
OH
TO HI-Z
C
LOAD
= 20pF
3.4k
SDO
2400 TA04
HI-Z TO V
OL
V
OH
TO V
OL
V
OL
TO HI-Z
C
LOAD
= 20pF
V
CC
Converter Operation Cycle
The LTC2400 is a low power, delta-sigma analog-to-
digital converter with an easy to use 3-wire serial interface.
Its operation is simple and made up of three states. The
converter operating cycle begins with the conversion,
followed by a low power sleep state and concluded with
the data output (see Figure 1). The 3-wire interface con-
sists of serial data output (SDO), a serial clock (SCK) and
a chip select (CS).
Initially, the LTC2400 performs a conversion. Once the
conversion is complete, the device enters the sleep state.
While in this sleep state, power consumption is reduced by
CONVERT
SLEEP
DATA OUTPUT
2400 F01
0
1
CS AND
SCK

LTC2400CS8#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 24-B Pwr No Lat Delta-Sigma ADC in SO-
Lifecycle:
New from this manufacturer.
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