4
Solder Reflow Temperature Profile
Regulatory Information
The HCPL-3140/HCPL-0314 have
been approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 2500 V
rms
. File
E55361.
CSA
Approval under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics (HCPL-3140 Option 060)
Description Symbol Characteristic Unit
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V
rms
I - IV
for rated mains voltage ≤ 300 V
rms
I - III
for rated mains voltage ≤ 600 V
rms
I-II
Climatic Classification 55/1 00/ 21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage V
IORM
630 V
peak
Input to Output Test Voltage, Method b*
V
IORM
x 1.875=V
PR
, 100% Production Test with V
PR
1181 V
peak
t
m
=1 sec, Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5=V
PR
, Type and Sample Test, t
m
=60 sec, V
PR
945 V
peak
Partial discharge < 5 pC
Highest Allowable Overvoltage V
IOTM
6000 V
peak
(Transient Overvoltage t
ini
= 10 sec)
Safety-limiting values - maximum values allowed in the
event of a failure.
Case Temperature T
S
175 °C
Input Current** I
S,INPUT
230 mA
Output Power** P
S, OUTPUT
600 mW
Insulation Resistance at T
S
, V
IO
= 500 V R
S
>10
9
Ω
* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/
DIN EN 60747-5-2 for a detailed description of Method a and Method b partial discharge test profiles.
** Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended Pb-Free IR Profile
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
