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LPC2460FET208,551

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69P70-P72P73-P75P76-P78P79-P81P82-P84P85-P87
LPC2420_60 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.2 — 16 October 2013 49 of 87
NXP Semiconductors
LPC2420/2460
Flashless 16-bit/32-bit microcontroller
9. Thermal characteristics
The average chip junction temperature, T
j
(C), can be calculated using the following
equation:
(1)
• T
amb
= ambient temperature (C),
• R
th(j-a)
= the package junction-to-ambient thermal resistance (C/W)
• P
D
= sum of internal and I/O power dissipation
The internal power dissipation is the product of I
DD
and V
DD
. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
j
T
amb
P
D
R
th j a–
+=
Table 7. Thermal characteristics
V
DD
= 3.0 V to 3.6 V; T
amb
=
40
C to +85
C unless otherwise specified;
Symbol Parameter Conditions Min Typ Max Unit
T
j(max)
maximum junction
temperature
--125 C
Table 8. Thermal resistance value (C/W): ±15 %
V
DD
= 3.0 V to 3.6 V; T
amb
=
40
C to +85
C unless otherwise specified;
LQFP208 TFBGA208
ja ja
JEDEC (4.5 in 4 in) JEDEC (4.5 in 4 in)
0 m/s 27.4 0 m/s 41
1 m/s 25.7 1 m/s 35
2.5 m/s 24.4 2.5 m/s 31
Single-layer (4.5 in 3 in) 8-layer (4.5 in 3 in)
0 m/s 35.4 0 m/s 34.9
1 m/s 31.2 1 m/s 30.9
2.5 m/s 29.2 2.5 m/s 28
jc 8.8 jc 8.3
jb 15.4 jb 13.6
LPC2420_60 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.2 — 16 October 2013 50 of 87
NXP Semiconductors
LPC2420/2460
Flashless 16-bit/32-bit microcontroller
10. Static characteristics
Table 9. Static characteristics
T
amb
=
40
C to +85
C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
V
DD(3V3)
supply voltage (3.3 V) core and external rail 3.0 3.3 3.6 V
V
DD(DCDC)(3V3)
DC-to-DC converter
supply voltage (3.3 V)
3.0 3.3 3.6 V
V
DDA
analog 3.3 V pad
supply voltage
3.0 3.3 3.6 V
V
i(VBAT)
input voltage on pin
VBAT
[2]
2.0 3.3 3.6 V
V
i(VREF)
input voltage on pin
VREF
2.5 3.3 V
DDA
V
I
DD(DCDC)act(3V3)
active mode
DC-to-DC converter
supply current (3.3 V)
V
DD(DCDC)(3V3)
=3.3V;
T
amb
=25C; code
while(1){}
executed from the on-chip
SRAM; no peripherals
enabled; PCLK = CCLK /
8
CCLK = 12 MHz - 17.4 - mA
CCLK = 72 MHz - 66.1 - mA
I
DD(DCDC)pd(3V3)
Power-down mode
DC-to-DC converter
supply current (3.3 V)
[3]
-113-A
I
DD(DCDC)dpd(3V3)
Deep power-down
mode DC-to-DC
converter supply
current (3.3 V)
[3]
-20-A
I
BATact
active mode battery
supply current
[4]
-20-A
I
BAT
battery supply current Deep power-down mode
[3]
-20-A
Standard port pins, RESET
, RTCK
I
IL
LOW-level input
current
V
I
= 0 V; no pull-up - - 3 A
I
IH
HIGH-level input
current
V
I
=V
DD(3V3)
; no
pull-down
-- 3A
I
OZ
OFF-state output
current
V
O
=0V; V
O
=V
DD(3V3)
;
no pull-up/down
-- 3A
I
latch
I/O latch-up current (0.5V
DD(3V3)
) < V
I
<
(1.5V
DD(3V3)
);
T
j
< 125 C
-- 100mA
V
I
input voltage pin configured to provide a
digital function
[5][6][7]
[8]
0- 5.5V
V
O
output voltage output active 0 - V
DD(3V3)
V
V
IH
HIGH-level input
voltage
2.0 - - V
LPC2420_60 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6.2 — 16 October 2013 51 of 87
NXP Semiconductors
LPC2420/2460
Flashless 16-bit/32-bit microcontroller
V
IL
LOW-level input
voltage
-- 0.8V
V
hys
hysteresis voltage 0.4 - - V
V
OH
HIGH-level output
voltage
I
OH
= 4 mA
[9]
V
DD(3V3)
0.4
--V
V
OL
LOW-level output
voltage
I
OL
= 4 mA
[9]
-- 0.4V
I
OH
HIGH-level output
current
V
OH
=V
DD(3V3)
0.4 V
[9]
4- - mA
I
OL
LOW-level output
current
V
OL
=0.4V
[9]
4- - mA
I
OHS
HIGH-level
short-circuit output
current
V
OH
=0V
[10]
-- 45 mA
I
OLS
LOW-level
short-circuit output
current
V
OL
=V
DDA
[10]
-- 50mA
I
pd
pull-down current V
I
=5V
[11]
10 50 150 A
I
pu
pull-up current V
I
=0V 15 50 85 A
V
DD(3V3)
<V
I
<5V
[11]
00 0A
I
2
C-bus pins (P0[27] and P0[28])
V
IH
HIGH-level input
voltage
0.7V
DD(3V3)
--V
V
IL
LOW-level input
voltage
- - 0.3V
DD(3V3)
V
V
hys
hysteresis voltage - 0.05V
DD(3V3)
-V
V
OL
LOW-level output
voltage
I
OLS
=3 mA
[9]
-- 0.4V
I
LI
input leakage current V
I
=V
DD(3V3)
[12]
-2 4A
V
I
= 5 V - 10 22 A
Oscillator pins
V
i(XTAL1)
input voltage on pin
XTAL1
0.5 1.8 1.95 V
V
o(XTAL2)
output voltage on pin
XTAL2
0.5 1.8 1.95 V
V
i(RTCX1)
input voltage on pin
RTCX1
0.5 1.8 1.95 V
V
o(RTCX2)
output voltage on pin
RTCX2
0.5 1.8 1.95 V
Table 9. Static characteristics …continued
T
amb
=
40
C to +85
C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69P70-P72P73-P75P76-P78P79-P81P82-P84P85-P87

LPC2460FET208,551

Mfr. #:
Buy LPC2460FET208,551
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 USBHOST/ENET ROMLESS
Lifecycle:
New from this manufacturer.
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