PESDXS1UB_SERIES_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 24 August 2009 9 of 15
NXP Semiconductors
PESDxS1UB series
ESD protection diodes in SOD523 package
Fig 8. ESD clamping test setup and waveforms
006aaa001
50
R
Z
C
Z
1
2
D.U.T.: PESDxS1UB
vertical scale = 200 V/div
horizontal scale = 50 ns/div
unclamped +1 kV ESD voltage waveform
(IEC61000-4-2 network)
clamped +1 kV ESD voltage waveform
(IEC61000-4-2 network)
unclamped 1 kV ESD voltage waveform
(IEC61000-4-2 network)
clamped 1 kV ESD voltage waveform
(IEC61000-4-2 network)
vertical scale = 20 V/div
horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 10 V/div
horizontal scale = 50 ns/div
GND
GND
GND
GND
450
RG 223/U
50 coax
ESD TESTER
IEC 61000-4-2 network
C
Z
= 150 pF; R
Z
= 330
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
GND
GND
GND
GND
PESD24VS1UB
PESD15VS1UB
PESD12VS1UB
PESD5V0S1UB
PESD3V3S1UB
PESDXS1UB_SERIES_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 24 August 2009 10 of 15
NXP Semiconductors
PESDxS1UB series
ESD protection diodes in SOD523 package
7. Application information
The PESDxS1UB series is designed for unidirectional protection of one single data line
from the damage caused by ESD (ElectroStatic Discharge) and Surge Pulses. The
PESDxS1UB series may be used on lines where the signal polarity is above or below
ground. The PESDxS1UB series provides a surge capability of up to 330 Watts per line for
a 8/20 µs waveform.
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, EFT and Surge transients.
The following guidelines are recommended:
1. Place the protection device as close to the input terminal or connector as possible.
2. The path length between the protection device and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductor.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit
boards, use ground vias.
Fig 9. Unidirectional protection of one line
006aaa002
ground
line to be protected
(positive signal polarity)
PESDxS1UB
uni-directional protection of one line
ground
line to be protected
(negative signal polarity)
PESDxS1UB
PESDXS1UB_SERIES_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 24 August 2009 11 of 15
NXP Semiconductors
PESDxS1UB series
ESD protection diodes in SOD523 package
8. Package outline
Fig 10. Package outline
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOD523 SC-79
02-12-13
06-03-16
Plastic surface-mounted package; 2 leads SOD523
0 0.5 1 mm
scale
D
12
H
E
E
b
p
A
c
v M
A
A
UNIT b
p
cD
E
v
mm
AH
E
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode.
(1)
0.34
0.26
0.17
0.11
0.1
0.85
0.75
1.25
1.15
0.65
0.58
1.65
1.55

PESD3V3S1UB,115

Mfr. #:
Manufacturer:
Nexperia
Description:
TVS Diodes / ESD Suppressors 3.3V ESD PROTECTION
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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