Thermal characteristics L6374
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4 Thermal characteristics
4.1 R
thJP
The reference point is the knee on the four central pins, where the pins are upwardly bent
and the soldering joint with the PCB footprint can be made.
4.2 R
thJA1
If a dissipating surface, thick at least 35 µm, and with a surface similar or bigger than the
one shown, is created making use of the printed circuit. Such heatsinking surface is
considered on the bottom side of an horizontal PCB (worst case).
4.3 R
thJA2
If the power dissipating pins (the four central ones), as well as the others, have a minimum
thermal connection with the external world (very thin strips only) so that the dissipation
takes place through still air and through the PCB itself.
It is the same situation of point above, without any heatsinking surface created on purpose
on the board.
Table 4. Thermal data
Symbol Parameter Value Unit
R
thJP
Thermal resistance, junction to pin 17 °C/W
R
thJA1
Thermal resistance, junction to ambient
(see thermal characteristics)
65 °C/W
R
thJA2
Thermal resistance, junction to ambient
(see thermal characteristics)
80 °C/W
