Philips Semiconductors Product specification
PowerMOS transistor BUK100-50GL
Logic level TOPFET
TRANSFER CHARACTERISTICS
T
mb
= 25 ˚C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
g
fs
Forward transconductance V
DS
= 10 V; I
DM
= 7.5 A t
p
≤ 300 µs; 5 9 - S
δ ≤ 0.01
I
D(SC)
Drain current
1
V
DS
= 13 V; V
IS
= 5 V - 25 - A
SWITCHING CHARACTERISTICS
T
mb
= 25 ˚C. R
I
= 50 Ω . Refer to waveform figures and test circuits.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
t
d on
Turn-on delay time V
DD
= 13 V; V
IS
= 5 V - 1.5 - µs
t
r
Rise time resistive load R
L
= 4 Ω -8-µs
t
d off
Turn-off delay time V
DD
= 13 V; V
IS
= 0 V - 6 - µs
t
f
Fall time resistive load R
L
= 4 Ω - 4.5 - µs
t
d on
Turn-on delay time V
DD
= 13 V; V
IS
= 5 V - 1.5 - µs
t
r
Rise time inductive load I
DM
= 3 A - 1 - µs
t
d off
Turn-off delay time V
DD
= 13 V; V
IS
= 0 V - 10 - µs
t
f
Fall time inductive load I
DM
= 3 A - 0.5 - µs
REVERSE DIODE LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
S
Continuous forward current T
mb
≤ 25 ˚C; V
IS
= 0 V - 13.5 A
REVERSE DIODE CHARACTERISTICS
T
mb
= 25 ˚C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
SDS
Forward voltage I
S
= 15 A; V
IS
= 0 V; t
p
= 300 µs - 1.0 1.5 V
t
rr
Reverse recovery time not applicable
2
----
ENVELOPE CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
L
d
Internal drain inductance Measured from contact screw on - 3.5 - nH
tab to centre of die
L
d
Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH
from package to centre of die
L
s
Internal source inductance Measured from source lead 6 mm - 7.5 - nH
from package to source bond pad
1 During overload before short circuit load protection operates.
2 The reverse diode of this type is not intended for applications requiring fast reverse recovery.
November 1996 4 Rev 1.300