IS61WV5128EDBLL-10TLI

Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. B
11/08/2011
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
IS61WV5128EDBLL
IS64WV5128EDBLL
FEATURES
High-speed access time: 8, 10 ns
Low Active Power: 85 mW (typical)
Low Standby Power: 7 mW (typical)
CMOS standby
Single power supply
V
dd 2.4V to 3.6V (10 ns)
V
dd 3.3V ± 10% (8 ns)
Fully static operation: no clock or refresh
required
Three state outputs
Industrial and Automotive temperature support
Lead-free available
Error Detection and Error Correction
512K x 8 HIGH SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH ECC
DESCRIPTION
The ISSI IS61/64WV5128EDBLL is a high-speed,
4,194,304-bit static RAMs organized as 524,288 words by
8 bits. It is fabricated using ISSI's high-performance CMOS
technology. This highly reliable process coupled with inno-
vative circuit design techniques, yields high-performance
and low power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be re-
duced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of
the memory.
The IS61/64WV5128EDBLL is packaged in the JEDEC
standard 44-pin TSOP-II, 36-pin SOJ and 36-pin Mini BGA
(6mm x 8mm).
FUNCTIONAL BLOCK DIAGRAM
NOVEMBER 2011
Memory Array
(512Kx8)
ECC Array
(512Kx4)
Decoder
I/O Data
Circuit
ECC
Column I/O
8 8 12
8 4
Control
Circuit
/CE
/OE
/WE
IO0-7
A0-A18
2 Integrated Silicon Solution, Inc. — www.issi.com
Rev. B
11/08/2011
IS61/64WV5128EDBLL
PIN CONFIGURATION (HIGH SPEED) (61/64WV5128ALL/BLL)
36 mini BGA
PIN DESCRIPTIONS
A0-A18 Address Inputs
CE Chip Enable Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Bidirectional Ports
Vdd Power
GND Ground
NC No Connection
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
A0
A1
A2
A3
A4
CE
I/O0
I/O1
V
DD
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
V
DD
I/O5
I/O4
A14
A13
A12
A11
A10
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
V
DD
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
NC
NC
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
V
DD
I/O5
I/O4
A14
A13
A12
A11
A10
NC
NC
NC
44
43
42
41
44-Pin TSOP (Type II)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
A0
I/O4
I/O5
GND
V
DD
I/O6
I/O7
A9
A1
A2
OE
A10
NC
WE
NC
A18
CE
A11
A3
A4
A5
A17
A16
A12
A6
A7
A15
A13
A8
I/O0
I/O1
V
DD
GND
I/O2
I/O3
A14
36-Pin SOJ
Integrated Silicon Solution, Inc. — www.issi.com 3
Rev. B
11/08/2011
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3
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IS61/64WV5128EDBLL
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
Vterm Terminal Voltage with Respect to GND –0.5 to Vdd + 0.5 V
Vdd Vdd Relates to GND –0.3 to 4.0 V
tstg Storage Temperature –65 to +150 °C
Pt Power Dissipation 1.0 W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
CAPACITANCE
(1,2)
Symbol Parameter Conditions Max. Unit
Cin Input Capacitance Vin = 0V 6 pF
C
i/O
Input/Output Capacitance VOut = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
a = 25°C, f = 1 MHz, Vdd = 3.3V.
ERROR DETECTION AND ERROR CORRECTION
Independent ECC with hamming code for each byte
Detect and correct one bit error per byte
Better reliability than parity code schemes which can only detect an error but not correct an error
Backward Compatible: Drop in replacement to current in industry standard devices (without ECC)
TRUTH TABLE
Mode CE WE OE I/O Operation VDD Current
Not Selected H X X High-Z isb1, isb2
(Power-down)
Output Disabled L H H High-Z iCC
Read L H L dOut iCC
Write L L X din iCC
OPERATING RANGE (VDD)
1
Range Ambient Temperature IS61WV5128EDBLL IS64WV5128EDBLL
VDD (8, 10nS) VDD (10nS)
Industrial –40°C to +85°C 2.4V-3.6V (10ns)
3.3V ± 10% (8ns)
Automotive (A1) –40°C to +85°C 2.4V-3.6V
Automotive (A3) –40°C to +125°C 2.4V-3.6V
Note:
1. Contact SRAM@issi.com for 1.8V option

IS61WV5128EDBLL-10TLI

Mfr. #:
Manufacturer:
ISSI
Description:
SRAM 4Mb 2.4-3.6V 10ns 512x8 Async SRAM
Lifecycle:
New from this manufacturer.
Delivery:
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