Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. A
06/01/2016
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest
version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
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c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
IS61WV51232ALL/ALS
IS61WV51232BLL/BLS
IS64WV51232BLL/BLS
512K x 32 HIGH-SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
JUNE 2016
FEATURES
• High-speedaccesstimes:
8, 10, 20 ns
• High-performance,low-powerCMOSprocess
• Multiplecenterpowerandgroundpinsforgreater
noise immunity
• EasymemoryexpansionwithCE and OE options
• CE power-down
• Fullystaticoperation:noclockorrefresh
required
• TTLcompatibleinputsandoutputs
• Singlepowersupply
Vdd 1.65V to 2.2V (IS61WV51232Axx)
speed = 20ns for Vdd 1.65V to 2.2V
Vdd 2.4V to 3.6V (IS61/64WV51232Bxx)
speed = 10ns for Vdd 2.4V to 3.6V
speed = 8ns for Vdd 3.3V + 5%
• Packagesavailable:
90-ball miniBGA (8mm x 13mm)
• IndustrialandAutomotiveTemperatureSupport
• Lead-freeavailable
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
TheISSI IS61WV51232Axx/Bxx and IS64WV51232Bxx are
high-speed,16M-bitstaticRAMsorganizedas512Kwords
by 32 bits. It is fabricated using ISSI's high-performance
CMOS technology.This highly reliableprocess coupled
with innovative circuit design techniques, yields high-
performance and low power consumption devices.
When CE is HIGH (deselected), the deviceassumes a
standby mode at which the power dissipation can be re-
duceddownwithCMOSinputlevels.
EasymemoryexpansionisprovidedbyusingChipEnable
andOutputEnableinputs,CE and OE.TheactiveLOW
Write Enable(WE) controls both writing and reading of
the memory.
Thedeviceispackagedinthe JEDECstandard 90-ball
BGA (8mm x 13mm).
A0-A18
CE
OE
WE
512K x 32
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
VSS
VDD
I/O
DATA
CIRCUIT
DQa-d
BWa-d
CE2
2 Integrated Silicon Solution, Inc. — www.issi.com
Rev. A
06/01/2016
IS61WV51232ALL/ALS
IS61WV51232BLL/BLS
IS64WV51232BLL/BLS
PIN CONFIGURATION
PACKAGECODE:
B90BALLFBGA(TopView)(8.00mmx13.00mmBody,0.8mmBallPitch)
1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
DQ1
DQ2
VSS
VSS
VDD
VSS
A0
A15
CE2
BWb
VDD
VSS
VSS
DQ13
DQ14
DQ0
VDD
DQ3
DQ6
DQ7
BWa
A1
A14
A17
NC
DQ8
DQ9
DQ12
VDD
DQ15
VSS
VSS
DQ4
DQ5
NC
A3
A2
A13
A16
A18
VSS
DQ10
DQ11
VSS
VSS
VDD
VDD
DQ27
DQ26
NC
A4
A10
A8
A9
OE
VDD
DQ21
DQ20
VDD
VDD
DQ31
VSS
DQ28
DQ25
DQ24
BWd
A5
A7
A12
WE
DQ23
DQ22
DQ19
VSS
DQ16
DQ30
DQ29
VDD
VDD
VSS
VDD
A6
A11
CE
BWc
VSS
VDD
VDD
DQ18
DQ17
PIN DESCRIPTIONS
A0-A18 Address Inputs
DQx DataI/O
CE,CE2ChipEnableInput
OE OutputEnableInput
WE WriteEnableInput
BWx (x=a-d) Byte Write Control
Vdd Power
Vss Ground
NC No Connection
Integrated Silicon Solution, Inc. — www.issi.com 3
Rev. A
06/01/2016
IS61WV51232ALL/ALS
IS61WV51232BLL/BLS
IS64WV51232BLL/BLS
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Parameter Value Unit
Vterm TerminalVoltagewithRespecttoGND –0.5toVdd + 0.5 V
Vdd VddRelatestoGND –0.3to4.0 V
tstg StorageTemperature –65to+150 °C
Pt PowerDissipation 1.0 W
Notes:
1.StressgreaterthanthoselistedunderABSOLUTEMAXIMUMRATINGSmaycausepermanentdamageto
thedevice.Thisisastressratingonlyandfunctionaloperationofthedeviceattheseoranyotherconditions
abovethoseindicatedintheoperationalsectionsofthisspecicationisnotimplied.Exposuretoabsolute
maximum rating conditions for extended periods may affect reliability.
CAPACITANCE
(1,2)
Symbol Parameter Conditions Max. Unit
Cin Input Capacitance Vin = 0V 6 pF
C
i/O
Input/OutputCapacitance VOut = 0V 8 pF
Notes:
1.Testedinitiallyandafteranydesignorprocesschangesthatmayaffecttheseparameters.
2. Testconditions:T
a = 25°C, f=1MHz,Vdd = 3.3V.
TRUTH TABLE
CE CE2 OE WE BWa BWb BWc BWd DQ0-7 DQ8-15 DQ16-23 DQ24-31 Mode Power
H X X X X X X X High-Z High-Z High-Z High-Z PowerDown (Isb)
X L X X X X X X High-Z High-Z High-Z High-Z PowerDown (Isb)
L H L H L L L L DataOut DataOut DataOut DataOut ReadAllBits (ICC)
L H L H L H H H DataOut High-Z High-Z High-Z ReadBytea (ICC)
BitsOnly
L H L H H L H H High-Z DataOut High-Z High-Z ReadByteb (ICC)
BitsOnly
L H L H H H L H High-Z High-Z DataOut High-Z ReadBytec (ICC)
BitsOnly
L H L H H H H L High-Z High-Z High-Z DataOut ReadByted (ICC)
BitsOnly
L H X L L L L L DataIn DataIn DataIn DataIn WriteAllBits (ICC)
L H X L L H H H DataIn High-Z High-Z High-Z WriteBytea (ICC)
BitsOnly
L H X L H L H H High-Z DataIn High-Z High-Z WriteByteb (ICC)
BitsOnly
L H X L H H L H High-Z High-Z DataIn High-Z WriteBytec (ICC)
BitsOnly
L H X L H H H L High-Z High-Z High-Z DataIn WriteByted (ICC)
BitsOnly
L H H H X X X X High-Z High-Z High-Z High-Z Selected, (ICC)
Outputs
 Disabled

IS61WV51232BLL-10BLI

Mfr. #:
Manufacturer:
ISSI
Description:
SRAM 16M (512Kx32) 10ns Async SRAM 3.3v
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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