19
FN6370.3
August 18, 2008
It should be noted that the ninth clock cycle of the read
operation is not a “don’t care.” To terminate a read operation,
the master must either issue a stop condition during the
ninth cycle or hold SDA HIGH during the ninth clock cycle
and then issue a stop condition.
Random Read
Random read operations allow the master to access any
location in the ISL12024. Prior to issuing the Slave Address
Byte with the R/W
bit set to zero, the master must first
perform a “dummy” write operation.
The master issues the start condition and the slave address
byte, receives an acknowledge, then issues the word
address bytes. After acknowledging receipt of each word
address byte, the master immediately issues another start
condition and the slave address byte with the R/W
bit set to
one. This is followed by an acknowledge from the device and
then by the 8-bit data word. The master terminates the read
operation by not responding with an acknowledge and then
issuing a stop condition. See Figure 21 for the address,
acknowledge and data transfer sequence.
In a similar operation called “Set Current Address,” the
device sets the address if a stop is issued instead of the
second start shown in Figure 21. The ISL12024 then goes
into Standby Power Mode after the stop and all bus activity
will be ignored until a start is detected. This operation loads
the new address into the address counter. The next Current
Address Read operation will read from the newly loaded
address. This operation could be useful if the master knows
the next address it needs to read, but is not ready for the
data.
Sequential Read
Sequential reads can be initiated as either a current address
read or random address read. The first data byte is
transmitted as with the other modes; however, the master
now responds with an acknowledge, indicating it requires
additional data. The device continues to output data for each
acknowledge received. The master terminates the read
operation by not responding with an acknowledge and then
issuing a stop condition.
The data output is sequential, with the data from address n
followed by the data from address n + 1. The address
counter for read operations increments through all page and
column addresses, allowing the entire memory contents to
be serially read during one operation. At the end of the
address space the counter “rolls over” to the start of the
address space and the ISL12024 continues to output data
for each acknowledge received. See Figure 22 for the
acknowledge and data transfer sequence.
0
SLAVE
ADDRESS
WORD
ADDRESS 1
A
C
K
A
C
K
S
T
A
R
T
S
T
O
P
SLAVE
ADDRESS
DATA
A
C
K
1
S
T
A
R
T
SDA BUS
SIGNALS FROM
THE SLAVE
SIGNALS FROM
THE MASTER
A
C
K
WORD
ADDRESS 0
1111
1111
0000000
FIGURE 21. RANDOM ADDRESS READ SEQUENCE
DATA
(2)
S
T
O
P
SLAVE
ADDRESS
DATA
(n)
A
C
K
A
C
K
SDA BUS
SIGNALS FROM
THE SLAVE
SIGNALS FROM
THE MASTER
1
DATA
(n-1)
A
C
K
A
C
K
(n is any integer greater than 1)
DATA
(1)
FIGURE 22. SEQUENTIAL READ SEQUENCE
ISL12024
20
FN6370.3
August 18, 2008
Application Section
Crystal Oscillator and Temperature Compensation
Intersil has now integrated the oscillator compensation
circuity on-chip, to eliminate the need for external
components and adjust for crystal drift over-temperature and
enable very high accuracy time keeping (<5ppm drift).
The Intersil RTC family uses an oscillator circuit with on-chip
crystal compensation network, including adjustable
load-capacitance. The only external component required is
the crystal. The compensation network is optimized for
operation with certain crystal parameters which are common
in many of the surface mount or tuning-fork crystals available
today. Table 6 summarizes these parameters.
Table 7 contains some crystal manufacturers and part
numbers that meet the requirements for the Intersil RTC
products.
The turnover-temperature in Table 6 describes the
temperature where the apex of the of the drift vs temperature
curve occurs. This curve is parabolic with the drift increasing
as (T-T0)
2
. For an Epson MC-405 device, for example, the
turnover-temperature is typically +25°C, and a peak drift of
>110ppm occurs at the temperature extremes of -40 and
+85°C. It is possible to address this variable drift by adjusting
the load capacitance of the crystal, which will result in
predictable change to the crystal frequency. The Intersil RTC
family allows this adjustment over-temperature since the
devices include on-chip load capacitor trimming. This control
is handled by the Analog Trimming Register, or ATR, which
has 6-bits of control. The load capacitance range covered by
the ATR circuit is approximately 3.25pF to 18.75pF, in
0.25pF increments. Note that actual capacitance would also
include about 2pF of package related capacitance. In-circuit
tests with commercially available crystals demonstrate that
this range of capacitance allows frequency control from
+80ppm to -34ppm, using a 12.5pF load crystal.
In addition to the analog compensation afforded by the
adjustable load capacitance, a digital compensation feature
is available for the Intersil RTC family. There are 3-bits
known as the Digital Trimming Register or DTR, and they
operate by adding or skipping pulses in the clock signal. The
range provided is ±30ppm in increments of 10ppm. The
default setting is 0ppm. The DTR control can be used for
coarse adjustments of frequency drift over-temperature or
for crystal initial accuracy correction.
A final application for the ATR control is in-circuit calibration
for high accuracy applications, along with a temperature
sensor chip. Once the RTC circuit is powered up with battery
backup, the IRQ
/F
OUT
output is set at 32.768kHz and
frequency drift is measured. The ATR control is then
adjusted to a setting which minimizes drift. Once adjusted at
a particular temperature, it is possible to adjust at other
discrete temperatures for minimal overall drift, and store the
resulting settings in the EEPROM. Extremely low overall
temperature drift is possible with this method. The Intersil
evaluation board contains the circuitry necessary to
implement this control.
TABLE 6. CRYSTAL PARAMETERS REQUIRED FOR INTERSIL RTCs
PARAMETER MIN TYP MAX UNITS NOTES
Frequency 32.768 kHz
Frequency Tolerance ±100 ppm Down to 20ppm if desired
Turnover Temperature 20 25 30 °C Typically the value used for most crystals
Operating Temperature Range -40 85 °C
Parallel Load Capacitance 12.5 pF
Equivalent Series Resistance 50 k
Ω For best oscillator performance
TABLE 7. CRYSTAL MANUFACTURERS
MANUFACTURER PART NUMBER TEMP RANGE (°C) +25°C FREQUENCY TOLERANCE (PPM)
Citizen CM201, CM202, CM200S -40 to +85 ±20
Epson MC-405, MC-406 -40 to +85 ±20
Raltron RSM-200S-A or B -40 to +85 ±20
SaRonix 32S12A or B -40 to +85 ±20
Ecliptek ECPSM29T-32.768K -10 to +60 ±20
ECS ECX-306/ECX-306I -10 to +60 ±20
Fox FSM-327 -40 to +85 ±20
ISL12024
21
FN6370.3
August 18, 2008
Layout Considerations
The crystal input at X1 has a very high impedance and will
pick up high frequency signals from other circuits on the
board. Since the X2 pin is tied to the other side of the crystal,
it is also a sensitive node. These signals can couple into the
oscillator circuit and produce double clocking or
mis-clocking, seriously affecting the accuracy of the RTC.
Care needs to be taken in layout of the RTC circuit to avoid
noise pickup. Figure 23 is a suggested layout for the
ISL12024 or ISL12026 devices in an 8 Ld SO package.
The X1 and X2 connections to the crystal are to be kept as
short as possible. A thick ground trace around the crystal is
advised to minimize noise intrusion, but ground near the X1
and X2 pins should be avoided as it will add to the load
capacitance at those pins. Keep in mind these guidelines for
other PCB layers in the vicinity of the RTC device. A small
decoupling capacitor at the V
DD
pin of the chip is mandatory,
with a solid connection to ground.
The ISL12024 product has a special consideration. The
IRQ
/F
OUT
pin on the 8 Ld SOIC package is located next to
the X2 pin. When this pin is used as a frequency output
(IRQ
/F
OUT
) and is set to 32.768kHz, noise can couple to the
X1 or X2 pins and cause double-clocking. The layout in
Figure 23 minimizes this by running the IRQ
/F
OUT
output
away from the X1 and X2 pins. Also, reducing the switching
current at this pin by careful selection of the pull-up resistor
value will reduce noise. Intersil suggests a minimum value of
5.1kΩ for 32.768kHz, and higher values (up to 20kΩ) for
lower frequency IRQ
/F
OUT
outputs.
For other RTC products, the same rules previously stated
should be observed, but adjusted slightly since the packages
and pinouts are different.
Oscillator Measurements
When a proper crystal is selected and the layout guidelines
above are observed, the oscillator should start-up in most
circuits in less than one second. Some circuits may take
slightly longer, but startup should definitely occur in less than
5 seconds. When testing RTC circuits, the most common
impulse is to apply a scope probe to the circuit at the X2 pin
(oscillator output) and observe the waveform. DO NOT DO
THIS! Although in some cases you may see a useable
waveform, due to the parasitics (usually 10pF to ground)
applied with the scope probe, there will be no useful
information in that waveform other than the fact that the
circuit is oscillating. The X2 output is sensitive to capacitive
impedance so the voltage levels and the frequency will be
affected by the parasitic elements in the scope probe.
Applying a scope probe can possibly cause a faulty oscillator
to start-up, hiding other issues (although in the Intersil RTCs,
the internal circuitry assures start-up when using the proper
crystal and layout).
The best way to analyze the RTC circuit is to power it up and
read the real-time clock as time advances, or if the chip has
the IRQ
/F
OUT
output, look at the output of that pin on an
oscilloscope (after enabling it with the control register, and
using a pull-up resistor for an open-drain output).
Alternatively, the ISL12024 device has an IRQ
/F
OUT
output
which can be checked by setting an alarm for each minute.
Using the pulse interrupt mode setting, the once-per-minute
interrupt functions as an indication of proper oscillation.
Backup Battery Operation
Many types of batteries can be used with the Intersil RTC
products. 3.0V or 3.6V Lithium batteries are appropriate, and
sizes are available that can power a Intersil RTC device for
up to 10 years. Another option is to use a supercapacitor for
applications where V
DD
may disappear intermittently for
short periods of time. Depending on the value of the Super
Cap used, backup time can last from a few days to two
weeks (with >1F). A simple silicon or Schottky barrier diode
can be used in series with V
DD
to charge the Super Cap,
which is connected to the V
BAT
pin. Try to use Schottky
diodes with very low leakages, <1
µA desirable. Do not use
the diode to charge a battery (especially lithium batteries!)
There are two possible modes for battery backup operation;
Standard and Legacy Mode. In Standard Mode, there are no
operational concerns when switching over to battery backup
since all other devices functions are disabled. Battery drain
is minimal in Standard Mode, and return to Normal V
DD
powered operations is predictable. In Legacy Mode, the
V
BAT
pin can power the chip if the voltage is above V
DD
and
less than V
TRIP
. In this mode, it is possible to generate alarm
and communicate with the device, unless SBI = 1, but the
supply current drain is much higher than the Standard Mode
and backup time is reduced. In this case if alarms are used
in backup mode, the IRQ
/F
OUT
pull-up resistor must be
connected to V
BAT
voltage source. During initial power-up
the default mode is the Standard Mode.
FIGURE 23. SUGGESTED LAYOUT FOR INTERSIL RTC IN SO-8
R5
47k
U1
X1
ISL12024

ISL12024IVZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Real Time Clock REAL TIME CLK/CLNDR W/EEPROM IN 8LD
Lifecycle:
New from this manufacturer.
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