AD8310
Rev. F | Page 21 of 24
Table 6. Evaluation Board Setup Options
Component Function Default Condition
TP1, TP2 Supply and Ground Vector Pins. Not applicable
SW1
Device Enable. When in Position A, the ENBL pin is connected to +V
S
, and the AD8310 is in normal
operating mode. When in Position B, the ENBL pin is connected to ground, putting the device into
sleep mode.
SW1 = A
R1/R4
SMA Connector Grounds. Connects common of INHI and INLO SMA connectors to ground. They
can be used to isolate the generator ground from the evaluation board ground. See Figure 28.
R1 = R4 = 0 Ω
C1, C2, R3
Input Interface. R3 (52.3 Ω) combines with the AD8310’s 1 kΩ input impedance to give an overall
broadband input impedance of 50 Ω. C1, C2, and the AD8310’s input impedance combine to set a
high-pass input corner of 32 kHz. Alternatively, R3, C1, and C2 can be replaced by an inductor and
matching capacitors to form an input matching network. See the Input Matching section for details.
R3 = 52.3 Ω,
C1 = C2 = 0.01 μF
C3
RSSI (Video) Bandwidth Adjust. The addition of C3 (farads) lowers the RSSI bandwidth of the
AD8310’s output according to the following equation:
C
FILT
= 1/(2π × 3 kΩ Video Bandwidth) − 2.1 pF
C3 = open
C4, C5, R5
Supply Decoupling. The normal supply decoupling of 0.01 μF (C4) can be augmented by a larger
capacitor in C5. An inductor or small resistor can be placed in R5 for additional decoupling.
C4 = 0.01 μF,
C5 = open, R5 = 0 Ω
R6
Output Source Impedance. In cable-driving applications, a resistor (typically 50 Ω or 75 Ω) can be
placed in R6 to give the circuit a back-terminated output impedance.
R6 = 0 Ω
W1, W2, C6, R7
Output Loading. Resistors and capacitors can be placed in C6 and R7 to load-test VOUT. Jumper W1
and Jumper W2 are used to connect or disconnect the loads.
C6 = R7 = open,
W1 = W2 = installed
C7
Offset Compensation Loop. A capacitor in C7 reduces the corner frequency of the offset control
loop in low frequency applications.
C7 = open
AD8310
Rev. F | Page 22 of 24
DIE INFORMATION
3
2
18
7
6
5B
5A
4
X
Y
BOND PAD STATISTICS
ALL MEASUREMENTS IN MICRONS
MINIMUM PASSIVATION OPENING: 92 × 92, MINIMUM PAD PITCH: 150
DIE SIZE CALCULATION
ALL MEASUREMENTS IN MICRONS
DIE X (WIDTH OF DIE IN X DIRECTION) = 745
DIE Y (WIDTH OF DIE IN Y DIRECTION) = 1390
DIE THICKNESS = 305
COORDINATES OF BOND PAD CENTERS:
(1) –233, +540 (2) –250, +310 (3) –250, –273
(4) –250, –519 (5B) +250, –366 (5A) +250, –516
(6) +250, –218 (7) +249, +310 (8) +233, +540
01084-044
Figure 43. Die Outline Dimensions
Table 7. Die Pad Function Descriptions
Pin No. Mnemonic Description
1 INLO One of Two Balanced Inputs. Biased roughly to VPOS/2.
2 COMM Common Pin. Usually grounded.
3 OFLT Offset Filter Access. Nominally at about 1.75 V.
4 VOUT Low Impedance Output Voltage. Carries a 25 mA maximum load.
5A, 5B VPOS Positive Supply. 2.7 V to 5.5 V at 8 mA quiescent current.
6 BFIN Buffer Input. Used to lower postdetection bandwidth.
7 ENBL CMOS Compatible Chip Enable. Active when high.
8 INHI Second of Two Balanced Inputs. Biased roughly to VPOS/2.
AD8310
Rev. F | Page 23 of 24
COMPLIANT TO JEDEC STANDARDS MO-187-AA
100709-B
0.80
0.55
0.40
OUTLINE DIMENSIONS
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
5.15
4.90
4.65
3.20
3.00
2.80
PIN 1
IDENTIFIER
0.95
0.85
0.75
15° MAX
0.15
0.05
Figure 44. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
AD8310ARM −40°C to +85°C 8-Lead MSOP, Tube RM-8 J6A
AD8310ARM-REEL7 −40°C to +85°C 8-Lead MSOP, 7” Tape and Reel RM-8 J6A
AD8310ARMZ −40°C to +85°C 8-Lead MSOP, Tube RM-8 J6A
AD8310ARMZ-REEL7 −40°C to +85°C 8-Lead MSOP, 7” Tape and Reel RM-8 J6A
AD8310ACHIPS −40°C to +85°C Die
AD8310-EVAL Evaluation Board
1
Z = RoHS Compliant Part.

AD8310ARMZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Logarithmic Amplifiers V-Out DC to 440 MHz 95dB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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