31
0805
Size
(L" x W")
5
Voltage
50V = 5
100V = 1
200V = 2
C
Dielectric
1B CG = A
2R1 = C
2F4 = G
103
Capacitance
Code
M
Capacitance
Tolerance
See Dielectrics
C0G, X7R, Y5V
T
Specification
CECC32101-801
T
Terminations
T = Plated Ni
and Sn
2
Marking
Packaging
2 = 7" Reel
4 = 13" Reel
A
Special
Code
A = Std.
Product
PART NUMBER (example)
RANGE OF APPROVED COMPONENTS
Case Dielectric
Voltage and Capacitance Range
Size Type 50V 100V 200V
1BCG
0603 1B CG 0.47pF - 150pF 0.47pF - 120pF 0.47pF - 100pF
0805 1B CG 0.47pF - 560pF 0.47pF - 560pF 0.47pF - 330pF
1206 1B CG 0.47pF - 3.3nF 0.47pF - 3.3nF 0.47pF - 1.5nF
1210 1B CG 0.47pF - 4.7nF 0.47pF - 4.7nF 0.47pF - 2.7nF
1808 1B CG 0.47pF - 6.8nF 0.47pF - 6.8nF 0.47pF - 4.7nF
1812 1B CG 0.47pF - 15nF 0.47pF - 15nF 0.47pF - 10nF
2220 1B CG 0.47pF - 39nF 0.47pF - 39nF 0.47pF - 15nF
2R1
0603 2R1 10pF - 6.8nF 10pF - 6.8nF 10pF - 1.2nF
0805 2R1 10pF - 33nF 10pF - 18nF 10pF - 3.3nF
1206 2R1 10pF - 100nF 10pF - 68nF 10pF - 18nF
1210 2R1 10pF - 150nF 10pF - 100nF 10pF - 27nF
1808 2R1 10pF - 270nF 10pF - 180nF 10pF - 47nF
1812 2R1 10pF - 470nF 10pF - 330nF 10pF - 100nF
2220 2R1 10pF - 1.2µF 10pF - 680nF 10pF - 220nF
2F4
0805 2F4 10pF - 100nF
1206 2F4 10pF - 330nF
1210 2F4 10pF - 470nF
1808 2F4 10pF - 560nF
1812 2F4 10pF - 1.8µF
2220 2F4 10pF - 2.2µF
European Detail Specifications
CECC 32 101-801/Chips
Standard European Ceramic Chip Capacitors
32
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mm 12mm
Paper or Embossed Carrier 0805, 1005, 1206,
1210
Embossed Only 0504, 0907 1505, 1805, 1812, 1825
1808 2220, 2225
Paper Only 0402, 0603
Qty. per Reel/7" Reel 2,000 or 4,000
(1)
3,000 1,000
Qty. per Reel/13" Reel 10,000 10,000 4,000
(1)
Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are
not available on 13" reels. For 3640 size chip contact factory for quantity per reel.
REEL DIMENSIONS
Tape A B*
C
D* N
W
1
W
2
W
3
Size
(1)
Max. Min. Min. Min. Max.
+1.0
7.9 Min.
8mm
8.4 –0.0 14.4 (.311)
(.331
+.060
) (.567) 10.9 Max.
330 1.5 13.0±0.20 20.2 50
–0.0
(.429)
(12.992) (.059) (.512±.008) (.795) (1.969)
+2.0
11.9 Min.
12mm
12.4 –0.0 18.4 (.469)
(.488
+.076
) (.724) 15.4 Max.
–0.0
(.607)
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
33
Tape Size B
1
D
1
FP
1
RT
2
WA
0
B
0
K
0
Max. Min. Min.
See Note 6 See Note 5 See Note 2
8mm
4.55 1.0 3.5 ± 0.05 4.0 ± 0.10 25 2.5 Max
See Note 1
(.179) (.039) (.138 ± .002) (.157 ± .004) (.984) (.098)
12mm
8.2 1.5 5.5 ± 0.05 4.0 ± 0.10 30 6.5 Max. 12.0 ± .30
See Note 1
(.323) (.059) (.217 ± .002) (.157 ± .004) (1.181) (.256) (.472 ± .012)
8mm 4.55 1.0 3.5 ± 0.05 2.0 ± 0.10 25 2.5 Max.
See Note 1
1/2 Pitch (.179) (.039) (.138 ± .002) 0.79 ± .004 (.984) (.098)
12mm
8.2 1.5 5.5 ± 0.05 8.0 ± 0.10 30 6.5 Max. 12.0 ± .30
See Note 1
Double
(.323) (.059) (.217 ± .002) (.315 ± .004) (1.181) (.256) (.472 ± .012)
Pitch
Embossed Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size D
0
EP
0
P
2
T Max. T
1
G
1
G
2
8mm 8.4
+0.10
1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.600 0.10 0.75 0.75-0.0
and
(.059
+.004
) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.024) (.004) (.030) (.030)
12mm
-0.0
Max. Min. Min.
See Note 3 See Note 4
VARIABLE DIMENSIONS
NOTES:
1. A
0
, B
0
, and K
0
are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A
0
, B
0
, and K
0
) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).
2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm
embossed tape for reels with hub diameters approaching N min. (Table 4).
3. G
1
dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the
cavity whichever is less.
4. G
2
dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity
or to the edge of the cavity whichever is less.
5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.
Dimensions of embossment location and hole location shall be applied independent of each other.
6. B
1
dimension is a reference dimension for tape feeder clearance only.
8.0
+0.3
-0.1
(.315
+.012
)-.004
8.0
+0.3
-0.1
(.315
+.012
)-.004

12061E224MAT2A

Mfr. #:
Manufacturer:
N/A
Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V .22uF Z5U 1206 20% Tol
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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