40
The seen in current microprocessors can be as high as
0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic
inductance can cause a voltage spike of 30mV. While this
does not sound very drastic, with the Vcc for microproces-
sors decreasing at the current rate, this can be a fairly large
percentage.
Another important, often overlooked, reason for knowing
the parasitic inductance is the calculation of the resonant
frequency. This can be important for high frequency, by-
pass capacitors, as the resonant point will give the most
signal attenuation. The resonant frequency is calculated
from the simple equation:
f
res = 1
2 LC
Insulation Resistance – Insulation Resistance is the resis-
tance measured across the terminals of a capacitor and
consists principally of the parallel resistance R
P shown in
the equivalent circuit. As capacitance values and hence the
area of dielectric increases, the I.R. decreases and hence
the product (C x IR or RC) is often specified in ohm farads
or more commonly megohm-microfarads. Leakage current
is determined by dividing the rated voltage by IR (Ohm’s
Law).
Dielectric Strength – Dielectric Strength is an expression
of the ability of a material to withstand an electrical stress.
Although dielectric strength is ordinarily expressed in volts, it
is actually dependent on the thickness of the dielectric and
thus is also more generically a function of volts/mil.
Dielectric Absorption – A capacitor does not discharge
instantaneously upon application of a short circuit, but
drains gradually after the capacitance proper has been dis-
charged. It is common practice to measure the dielectric
absorption by determining the “reappearing voltage” which
appears across a capacitor at some point in time after it has
been fully discharged under short circuit conditions.
Corona – Corona is the ionization of air or other vapors
which causes them to conduct current. It is especially
prevalent in high voltage units but can occur with low voltages
as well where high voltage gradients occur. The energy
discharged degrades the performance of the capacitor and
can in time cause catastrophic failures.
di
dt
General Description
41
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
D1
D2
D3
D4
D5
Case Size D1 D2 D3 D4 D5
0402 1.70 (0.07) 0.60 (0.02) 0.50 (0.02) 0.60 (0.02) 0.50 (0.02)
0603 2.30 (0.09) 0.80 (0.03) 0.70 (0.03) 0.80 (0.03) 0.75 (0.03)
0805 3.00 (0.12) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.25 (0.05)
1206 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 1.60 (0.06)
1210 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 2.50 (0.10)
1808 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 2.00 (0.08)
1812 5.60 (0.22) 1.00 (0.04)) 3.60 (0.14) 1.00 (0.04) 3.00 (0.12)
1825 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 6.35 (0.25)
2220 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 5.00 (0.20)
2225 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 6.35 (0.25)
Dimensions in millimeters (inches)
REFLOW SOLDERING
42
WAVE SOLDERING
Component Spacing
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less impor-
tant for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
Preheat & Soldering
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
Surface Mounting Guide
MLC Chip Capacitors
D1
D2
D3
D4
D5
Case Size D1 D2 D3 D4 D5
0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03)
0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05)
1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06)
1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10)
Dimensions in millimeters (inches)
1mm (0.04)
1.5mm (0.06)
1mm (0.04)

12061E224MAT2A

Mfr. #:
Manufacturer:
N/A
Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 100V .22uF Z5U 1206 20% Tol
Lifecycle:
New from this manufacturer.
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