16
AT24C01A/02/04/08/16
0180R–SEEPR–4/04
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. This device is not recommended for new designs. Please refer to AT24C08A.
AT24C08
(2)
Ordering Information
Ordering Code Package Operation Range
AT24C08-10PI-2.7
AT24C08N-10SI-2.7
AT24C08-10TI-2.7
8P3
8S1
8A2
Industrial
(-40°C to 85°C)
AT24C08-10PI-1.8
AT24C08N-10SI-1.8
AT24C08-10TI-1.8
8P3
8S1
8A2
Industrial
(-40°C to 85°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
-2.7 Low-voltage (2.7V to 5.5V)
-1.8 Low-voltage (1.8V to 5.5V)
17
AT24C01A/02/04/08/16
0180R–SEEPR–4/04
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. This device is not recommended for new designs. Please refer to AT24C16A.
AT24C16
(2)
Ordering Information
Ordering Code Package Operation Range
AT24C16-10PI-2.7
AT24C16N-10SI-2.7
AT24C16-10TI-2.7
8P3
8S1
8A2
Industrial
(-40°C to 85°C)
AT24C16-10PI-1.8
AT24C16N-10SI-1.8
AT24C16-10TI-1.8
8P3
8S1
8A2
Industrial
(-40°C to 85°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
Options
-2.7 Low-voltage (2.7V to 5.5V)
-1.8 Low-voltage (1.8V to 5.5V)
18
AT24C01A/02/04/08/16
0180R–SEEPR–4/04
Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2

AT24C08N-10SI-1.8

Mfr. #:
Manufacturer:
Description:
IC EEPROM 8K I2C 400KHZ 8SOIC
Lifecycle:
New from this manufacturer.
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