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AT24C08N-10SI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
22
AT24C01A/02/04/08/16
0180R–SEEPR–4/04
5TS1 – SOT23
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
PO5TS1 A
6/25/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
A – – 1.10
A1 0.00 – 0.10
A2 0.70 0.90 1.00
c 0.08 – 0.20 4
D 2.90 BSC 2, 3
E 2.80 BSC 2, 3
E1 1.60 BSC 2, 3
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 – 0.50 4, 5
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
shall not be less than 0.07 mm.
5
4
2
L1
L
C
End View
C
A
A2
A1
b
e
Seating
Plane
D
Side View
e1
E1
3
1
Top View
E
23
AT24C01A/02/04/08/16
0180R–SEEPR–4/04
8U3-1 – dBGA2
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
PO8U3-1 A
6/24/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
A 0.71 0.81 0.91
A1 0.10 0.15 0.20
A2 0.40 0.45 0.50
b 0.20 0.25 0.30
D 1.50 BSC
E 2.00 BSC
e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF
1. Dimension 'b' is measured at the maximum solder ball diameter.
This drawing is for general information only.
Bottom View
8 SOLDER BALLS
b
D
E
Top View
PIN 1 BALL PAD CORNER
A
Side View
A
2
A
1
4
5
PIN 1 BALL PAD CORNER
31
e
2
67
8
d
(e1)
(d1)
1.
Printed on recycled paper.
0180R–SEEPR–4/04
xM
Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use
as critical components in life support devices or systems.
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®
and combinations thereof, are the registered trademarks, and dBGA
™
is the
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AT24C08N-10SI-1.8

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IC EEPROM 8K I2C 400KHZ 8SOIC
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