ISL6535
7
FN9255.3
March 3, 2016
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Functional Description
Initialization
The ISL6535 automatically initializes upon receipt of power.
Special sequencing of the input supplies is not necessary. The
Power-On Reset (POR) function continually monitors the bias
voltage at the VCC pin and the driver input on the PVCC pin. When
the voltages at VCC and PVCC exceed their rising POR thresholds,
a 30µA current source driving the SS pin is enabled. Upon the SS
pin exceeding 1V, the ISL6535 begins ramping the noninverting
input of the error amplifier from GND to the System Reference.
During initialization the MOSFET drivers, pull UGATE to PHASE
and LGATE to PGND.
Soft-Start
During soft-start, an internal 30µA current source charges the
external capacitor (C
SS
) on the SS pin up to ~4V. If the ISL6535 is
utilizing the internal reference, then as the SS pin’s voltage
ramps from 1V to 3V, the soft-start function scales the reference
input (positive terminal of error amp) from GND to VREF (0.597V
nominal). If the ISL6535 is utilizing an externally supplied
reference, when the voltage on the SS pin reaches 1V, the
internal reference input (into of the error amp) ramps from GND
to the externally supplied reference at the same rate as the
voltage on the SS pin. Figure 6
shows a typical soft-start interval.
The rise time of the output voltage is, therefore, dependent upon
the value of the soft-start capacitor, CSS. If the internal reference
is used, then the soft-start capacitance value can be calculated
through Equation 3:
If an external reference is used, then the soft-start capacitance
can be calculated through Equation 4
:
Prebiased Load Start-Up
Drivers are held in tri-state (UG pulled to Phase, LG pulled to
PGND) at the beginning of a soft-start cycle until two PWM pulses
are detected. The low-side MOSFET is turned on first to provide
for charging of the bootstrap capacitor. This method of driver
activation provides support for start-up into prebiased loads by
not activating the drivers until the control loop has entered its
linear region, thereby substantially reducing output transients
that would otherwise occur had the drivers been activated at the
beginning of the soft-start cycle.
SSDONE
Soft-start is only available in the 16 Ld QFN packaging option of
the ISL6535. When the soft-start pin reaches 4V, an open drain
signal is provided to support sequencing requirements. The
SSDONE is deasserted by disabling of the part, including pulling
SS low, and by POR and OCP events.
Typical Performance Curves
FIGURE 4. R
RT
RESISTANCE vs FREQUENCY
FIGURE 5. BIAS SUPPLY CURRENT vs FREQUENCY
10k 100k 1M
SWITCHING FREQUENCY (Hz)
RESISTANCE (k)
10
100
1000
R
RT
PULL-UP
TO +12V
R
RT
PULLDOWN
TO GND
100 200 300 400 500 600 700 800 900 1k
80
70
60
50
40
30
20
10
0
I
PVCC+VCC
(mA)
SWITCHING FREQUENCY (kHz)
C
GATE
= 1000pF
C
GATE
= 3300pF
C
GATE
= 10pF
C
SS
30At
SS
2V
----------------------------
=
(EQ. 3)
C
SS
30At
SS
V
REFEXT
----------------------------
=
(EQ. 4)
FIGURE 6. TYPICAL SOFT-START INTERVAL
V
EN
V
OUT
V
SS
t
SS
ISL6535
8
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March 3, 2016
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Oscillator
The oscillator is a triangular waveform, providing for leading and
falling edge modulation. The peak-to-peak of the ramp
amplitude is set at 1.9V and varies as a function of frequency. At
50kHz the peak-to-peak amplitude is approximately 1.8V while
at 1.5MHz it is approximately 2.2V. In the event the regulator
operates at 100% duty cycle for 64 clock cycles an automatic
boot cap refresh circuit will activate turning on LG for
approximately 1/2 of a clock cycle.
Overcurrent Protection
The OCP function is enabled with the drivers at start-up. OCP is
implemented via a resistor (R
OCSET
) and a capacitor (C
OCSET
)
connecting the OCSET pin and the drain of the high-side MOSEFT.
An internal 200µA current source develops a voltage across
R
OCSET
, which is then compared with the voltage developed
across the high-side MOSFET at turn-on as measured at the
PHASE pin. When the voltage drop across the MOSFET exceeds
the voltage drop across the resistor, a sourcing OCP event occurs.
The C
OCSET
is placed in parallel with R
OCSET
to smooth the
voltage across R
OCSET
in the presence of switching noise on the
input bus.
A 120ns blanking period is used to reduce the current sampling
error due to leading-edge switching noise. An additional
simultaneous 120ns low pass filter is used to further reduce
measurement error due to noise.
OCP faults cause the regulator to disable (upper and lower drives
disabled, SSDONE pulled low, soft-start capacitor discharged)
itself for a fixed period of time, after which a normal soft-start
sequence is initiated. If the voltage on the SS pin is already at 4V
and an OCP is detected, a 30mA current sink is immediately
applied to the SS pin. If an OCP is detected during soft-start, the
30µA current sink will not be applied until the voltage on the SS
pin has reached 4V. This current sink discharges the CSS
capacitor in a linear fashion. Once the voltage on the SS pin has
reached approximately 0V, the normal soft-start sequence is
initiated. If the fault is still present on the subsequent restart, the
ISL6535 will repeat this process in a hiccup mode. Figure 7
shows a typical reaction to a repeated overcurrent condition that
places the regulator in a hiccup mode. If the regulator is
repeatedly tripping overcurrent, the hiccup period can be
approximated by Equation 5:
The OCP trip point varies mainly due to MOSFET r
DS(ON)
variations and layout noise concerns. To avoid overcurrent
tripping in the normal operating load range, find the ROCSET
resistor from the following equations with:
1. The maximum r
DS(ON)
at the highest junction temperature.
2. The minimum I
OCSET
from the specification table.
Determine the overcurrent trip point greater than the maximum
output continuous current at maximum inductor ripple current.
High Speed MOSFET Gate Driver
The integrated driver has the same drive capability and feature as
the Intersil’s 12V gate driver, ISL6612. The PWM tri-state feature
helps prevent a negative transient on the output voltage when the
output is being shut down. This eliminates the Schottky diode that
is used in some systems for protecting the microprocessor from
reversed output voltage damage. See the ISL6612
datasheet for
specification parameters that are not defined in the current
ISL6535 “Electrical Specifications” table on page 5
.
Reference Input
The REFIN pin allows the user to bypass the internal 0.597V
reference with an external reference. If REFIN is NOT above
~2.2V, the external reference pin is used as the control reference
instead of the internal 0.597V reference. When is not using the
external reference option, the REFIN pin should be left floating.
An internal 6
µA pull-up keeps this REFIN pin above 2.2V in this
situation.
Internal Reference and System Accuracy
The internal reference is set to 0.597V. The total DC system
accuracy of the system is to be within 1.0% over commercial
temperature range and 1.5% over the industrial temperature
range. System accuracy includes error amplifier offset and
reference error. The use of REFIN may add up to 3mV of offset
error into the system (as the error amplifier offset is trimmed out
via the internal system reference).
FIGURE 7. TYPICAL OVERCURRENT PROTECTION
V
SSDONE
V
SS
I
LOAD
t
HICCUP
I
OCP
t
HICCUP
8V C
SS
30A
------------------------
=
(EQ. 5)
R
OCSET
I
OC_SOURCE
I
2
-----
+


r
DS ON
I
HSOC
N
U
----------------------------------------------------------------------------------
=
N
U
NUMBER OF HIGH SIDE MOSFETs=
R
OCSET
I
OC_SOURCE
r
DS ON
200A
----------------------------------------------------------------
=
SIMPLE OCP EQUATION
DETAILED OCP EQUATION
I =
V
IN
- V
OUT
f
SW
L
OUT
--------------------------------
V
OUT
V
IN
----------------
f
SW
Regulator Switching Frequency=
(EQ. 6)
ISL6535
9
FN9255.3
March 3, 2016
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Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using wide,
short printed circuit traces. The critical components should be
located as close together as possible using ground plane
construction or single point grounding.
A multilayer printed circuit board is recommended. Figure 8
shows the critical components of the converter. Note that
capacitors C
IN
and C
OUT
could each represent numerous physical
capacitors. Dedicate one solid layer (usually a middle layer of the
PC board) for a ground plane and make all critical component
ground connections with vias to this layer. Dedicate another solid
layer as a power plane and break this plane into smaller islands
of common voltage levels. Keep the metal runs from the PHASE
terminals to the output inductor short. The power plane should
support the input power and output power nodes. Use copper
filled polygons on the top and bottom circuit layers for the phase
nodes. Use the remaining printed circuit layers for small signal
wiring.
Locate the ISL6535 within 2 to 3 inches of the MOSFETs, Q
1
and
Q
2
(1 inch or less for 500kHz or higher operation). The circuit
traces for the MOSFETs’ gate and source connections from the
ISL6535 must be sized to handle up to 3A peak current.
Minimize any leakage current paths on the SS pin and locate the
capacitor C
SS
close to the SS pin as the internal current source is
only 30µA. Provide local V
CC
decoupling between VCC and GND
pins. Locate the capacitor C
BOOT
as close as practical to the
BOOT pin and the phase node.
FIGURE 8. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
V
OUT
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
L
OUT
C
OUT
C
IN
VIN
KEY
VIA CONNECTION TO GROUND PLANE
LOAD
Q
1
Q
2
+12V
C
BP_VCC
C
BP_PVCC
C
IN
C
SS
ISL6535
UGATE
PHASE
GND
PVCC
LGATE
VCC
BOOT
SS
PGND
TRACE SIZED FOR 3A PEAK CURRENT
SHORT TRACE, MINIMUM IMPEDANCE
FIGURE 9. COMPENSATION CONFIGURATION FOR THE
ISL6535 CIRCUIT
FIGURE 10. VOLTAGE-MODE BUCK CONVERTER COMPENSATION
DESIGN
ISL6535
COMP
C
1
R
2
R
1
FB
VOUT
C
2
R
3
C
3
-
+
E/A
VREF
COMP
C
1
R
2
R
1
FB
C
2
R
3
C
3
L
C
V
IN
PWM
CIRCUIT
HALF-BRIDGE
DRIVE
OSCILLATOR
ESR
EXTERNAL CIRCUITISL6535
V
OUT
V
OSC
DCR
UGATE
PHASE
LGATE
GND

ISL6535CBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers PWM CNTRLR DDRG 14LD N
Lifecycle:
New from this manufacturer.
Delivery:
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