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HMC525ALC4

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
4 GHz to 8.5 GHz,
GaAs, MMIC, I/Q Mixer
Data Sheet
HMC525ALC4
Rev. A Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Passive: no dc bias required
Conversion loss: 8 dB (typical)
Input IP3: 20 dBm (typical)
LO to RF isolation: 47 dB (typical)
IF frequency range: dc to 3.5 GHz
RoHS compliant, 24-terminal, 4 mm × 4 mm LCC package
APPLICATIONS
Microwave and very small aperture terminal radios
Test equipment
Point to point radios
Military electronic warfare; electronic countermeasure; and
command, control, communications, and intelligence
FUNCTIONAL BLOCK DIAGRAM
13
1
3
4
2
7
NIC
NIC
GND
RF
5
6
GND
NIC
NIC
14 GND
15 LO
16
GND
17 NIC
18
NIC
NIC
8NIC
9
IF1
10NIC
11
IF2
12
19
GND
GND
NIC
20 NIC
21
NIC
22
NIC
23 NIC
24 NIC
PACKAGE
BASE
90° HYBRID
HMC525ALC4
16401-001
Figure 1.
GENERAL DESCRIPTION
The HMC525ALC4 is a compact gallium arsenide (GaAs),
monolithic microwave integrated circuit (MMIC), in phase
quadrature (I/Q) mixer in a 24-terminal, RoHS compliant, ceramic
leadless chip carrier (LCC) package. The device can be used as
either an image reject mixer or a single sideband (SSB)
upconverter. The mixer uses two standard double balanced
mixer cells and a 90° hybrid fabricated in a GaAs, metal
semiconductor field effect transistor (MESFET) process. The
HMC525ALC4 is a much smaller alternative to a hybrid style
image reject mixer and a SSB upconverter assembly. The
HMC525ALC4 eliminates the need for wire bonding, allowing the
use of surface-mount manufacturing techniques.
HMC525ALC4 Data Sheet
Rev. A | Page 2 of 28
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance ...................................................... 6
Upconverter Performance ......................................................... 12
Phase and Amplitude Balance—Downconverter................... 18
Isolation and Return Loss ......................................................... 20
IF Bandwidth—Downconverter ............................................... 22
Spurious and Harmonics Performance ................................... 24
Theory of Operation ...................................................................... 25
Applications Information .............................................................. 26
Typical Application Circuit ....................................................... 26
Evaluation PCB Information .................................................... 26
Soldering Information and Recommended Land Pattern .... 27
Outline Dimensions ....................................................................... 28
Ordering Guide .......................................................................... 28
REVISION HISTORY
5/2018—Rev. 0 to Rev. A
Changes to Typical Application Circuit Section......................... 26
4/2018—Revision 0: Initial Version
Data Sheet HMC525ALC4
Rev. A | Page 3 of 28
SPECIFICATIONS
LO = 15 dBm, intermediate frequency (IF) = 100 MHz, RF = −10 dBm, T
A
= 25°C, unless otherwise noted. All measurements were made
as downconverter with lower sideband selected (high-side LO) and an external 90° IF hybrid at the IF ports, unless otherwise noted.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE
RF 4 8.5 GHz
LO Input 4 8.5 GHz
IF DC 3.5 GHz
LO AMPLITUDE 13 15 17 dBm
4 GHz to 8.5 GHz PERFORMANCE
Downconverter Taken as image reject mixer
Conversion Loss 8 11 dB
Noise Figure 8 dB
Input Third-Order Intercept (IP3) 17 20 dBm
Input Power for 1dB Compression (P1dB) 13 dBm
Image Rejection 23 30 dBc
Upconverter Taken as SSB upconverter mixer
Conversion Loss 7.5 dB
Input IP3 20 dBm
Input P1dB 8.5 dBm
Sideband Rejection 30 dBc
Isolation Taken without external 90° IF hybrid
LO to RF 35 47 dB
LO to IF 23 dB
RF to IF 42 dB
Balance
Taken without external 90° IF hybrid
Phase 2 Degree
Amplitude 0.05 dB
4.5 GHz to 6 GHz PERFORMANCE
Downconverter Taken as image reject mixer
Conversion Loss 7.5 9.5 dB
Noise Figure 7.5 dB
Input IP3 17 21 dBm
Input P1dB 12 dBm
Image Rejection 25 30 dBc
Upconverter Taken as SSB upconverter mixer
Conversion Loss 7 dB
Input IP3 22 dBm
Input P1dB 10.5 dBm
Sideband Rejection
30
dBc
Isolation Taken without external 90° IF hybrid
LO to RF 35 45 dB
LO to IF 21 dB
RF to IF 40 dB
Balance Taken without external 90° IF hybrid
Phase 3 Degree
Amplitude 0.15 dB
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HMC525ALC4

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